Thermally Conductive Flame Retardant UL-94-V0 Electrically Insulating Epoxy Adhesive Solvent Resist
Click Image for Gallery
Thermo-Bond 12 is flame retardant and is designed to meet the rigid requirement of UL-94-V0. Thermo-Bond 12 is heavily filled alumina oxide epoxy formulations characterized by outstanding physical, electrical, insulation, and thermal dissipation properties which exhibit exceptional thermal conductivity, low thermal expansion, as well as excellent chemical and solvent resistance.
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 100/4 |
| Working Life @ 25°C | 30 Minutes |
| Hardness, Shore D | 92 |
| Particle Size | 44 |
| Shelf Life | 1 year |
| Cure Type | Room Temp |
| Cure Schedule | 24 hours @ Room Temp 3 hours @ 65 °C |
| Benefits | |
| Designed for applications requiring room temperature curing, will remain rigid Up to service temperature of 150C. | |
| Typical Applications | |
| is designed for applications requiring room temperature curing, will remain rigid Up to service temperature of 150C | |
Physical Properties |
|
| Appearance | Black |
| Filler | Alumina |
| Viscosity | 90000 |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 17000 |
| Specific Gravity @ 25°C | 2.3 |
| Hardness | 92 |
| Lap Shear Strength | 8500 |
| Reactive Solids Content, % | 100 |
| Shrinkage Linear, IN/IN | 0.001 |
| Tensile Strength, PSI | 8500 |
Electrical Properties |
|
| Volume Resistivity | 4.90E+16 ohm. cm |
| Dielectric Constant | 6.4 |
| Dielectric Strength | 560 |
| Dissipation Factor KV/IN | 0.018 |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +150°C |
| Glass Transition Temp (Tg) | |
| Thermal Expansion Coefficient, per °C | 30 |
| Heat Distortion, °C | 175 |
| Thermal Conductivity W/M-K | 1.66 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 11.5 |
