Electrically Conductive Silver Filled Adhesive Thermally Conductive Silver Epoxy Fast dry 4 hours
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- Product Code: Electro-Bond X1
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Electro-Bond X1 is a two parts electrically and thermally conductive epoxy specially designed for fast 4 hour cure time. It has a work time of 5 minutes therefore the mixing and application must be performed more quickly, This product is characterized by a wide operating temperature range from –20 to +200°F. Electro-Bond X1 is recommended for thermal and electrical application for production environments due to its faster bodning time and excellent shear strength.
Typical Properties |
|
Components | 2 |
Mix Ratio | 100/5 |
Working Life @ 25°C | 6 Minutes |
Hardness, Shore D | 83 |
Particle Size | 44 |
Shelf Life | 6 months |
Cure Type | Room Temperature |
Cure Schedule | 4 hours @ Room Temp 10 minutes @ 60 °C |
Benefits | |
Designed For fast cure rear Window Defroster, Grid Repair and Tab adhesives. | |
Typical Applications | |
Back Glass Defroster power tab antenna repair and electrically conductive components repair. | |
Physical Properties |
|
Appearance | Silver |
Filler | Silver |
Viscosity | Paste |
Substrates | Glas, aluminum, Steel Bronze and ceramic |
Density @ 25°C | |
Compressive Strength, PSI | 13400 |
Specific Gravity @ 25°C | 2.64 |
Hardness | 83 |
Lap Shear Strength | 9400 |
Reactive Solids Content, % | 100 |
Shrinkage Linear, IN/IN | 0.003 |
Tensile Strength, PSI | 2200 |
Electrical Properties |
|
Volume Resistivity | 1.00 E-03 ohm. cm |
Thermal Properties |
|
Thermal Conductivity @ 25 °C | |
Operating Temp | From -20 to +200°F |
Glass Transition Temp (Tg) | 60 |
Thermal Expansion Coefficient, per °C | |
Heat Distortion, °C | 95 |
Thermal Conductivity W/M-K | 1.46 |
Thermal Conductivity BTU-IN/HR-FT²-°F | 10 |