Flexible Copper Silver Thermally Conductive Epoxy Electrically Conductive Adhesive Room Temp Cure
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Electro-Bond 14 is a Flexible epoxy adhesive and coating formulaton based on conductive copper. Electro-Bond 14 is recommended for electronic bonding and sealing applications that requied both electrical and mechanical properties. Electro-Bond 14 cures at room temperature or can be accelerated with mild heat to form strong bond between similar and dissimilar substrates.
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 90/100 |
| Working Life @ 25°C | 45 Minutes |
| Hardness, Shore D | 60 |
| Particle Size | 45 |
| Shelf Life | 1 year |
| Cure Type | Room Temp / Heat Cure |
| Cure Schedule | 24 hours @ Room Temp 2 to 4 hours @ 60°C |
| Benefits | |
| Designed for flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components. | |
| Typical Applications | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. | |
Physical Properties |
|
| Appearance | Grey |
| Filler | Silver/Copper |
| Viscosity | Paste |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 3000 |
| Specific Gravity @ 25°C | 2.32 |
| Hardness | 60 |
| Lap Shear Strength | 9400 |
| Reactive Solids Content, % | 100 |
| Shrinkage Linear, IN/IN | 0.003 |
| Tensile Strength, PSI | 1240 |
Electrical Properties |
|
| Volume Resistivity | 3.60 E+5 ohm. cm |
| Dielectric Constant | 4.1 |
| Dielectric Strength | 410 |
| Dissipation Factor KV/IN | 0.015 |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +170°C |
| Glass Transition Temp (Tg) | 60°C |
| Thermal Expansion Coefficient, per °C | 30 |
| Heat Distortion, °C | 149 |
| Thermal Conductivity W/M-K | 1.16 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 8.1 |
