Graphite Filled Electrically Conductive Epoxy EMI RFI Shielding Adhesive Military Grade Heat Cure

Graphite Filled Electrically Conductive Epoxy EMI RFI Shielding Adhesive Military Grade Heat Cure
  • Views: 38034
  • Brand: ConductiveX
  • Product Code: Electro-Bond 63
  • Availability: In Stock
  • $0.00

Available Options

Electro-Bond 63 is one component graphite fille epoxy designed for Esd/Emi Shielding of semiconductor devices and electronics. Electro-Bond 63 can be used in many electronic application. Electro-Bond 63 is free of solvents, develops strong and durable, bonds to differents and dissimilar materilas such as metals, ceramics, glass .


Typical Properties

Components 1
Working Life @ 25°C 6 months
Hardness, Shore D 80
Particle Size 25
Shelf Life 6 months
Cure Type Heat Cure
Cure Schedule 1 hour @ 120 C
Benefits
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.

Physical Properties

Appearance Grey
Filler Graphite
Viscosity Paste
Substrates aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI 11000
Specific Gravity @ 25°C 1.28
Hardness 80
Lap Shear Strength 2600
Reactive Solids Content, % 100
Shrinkage Linear, IN/IN 0.003
Tensile Strength, PSI 3600

Electrical Properties

Volume Resistivity 43 ohm. cm

Thermal Properties

Thermal Conductivity @ 25 °C
Operating Temp from –50 to +170°C
Glass Transition Temp (Tg)
Thermal Expansion Coefficient, per °C
Heat Distortion, °C 170
Thermal Conductivity W/M-K 0.25
Thermal Conductivity BTU-IN/HR-FT²-°F 1.7

Tags: conductive epoxy, conductive adhesives, Graphite epoxy, graphite epoxies, graphite adhesive, graphite adhesives, flexible conductive graphite, flexible conductive adhesive