Silver Filled Epoxy Adhesive, Electrically Conductive Adhesive, Circuit Repair, 1 Part Heat Cure

Silver Filled Epoxy Adhesive, Electrically Conductive Adhesive, Circuit Repair, 1  Part Heat Cure
  • Views: 45358
  • Brand: ConductiveX
  • Product Code: Electro-Bond 01
  • Availability: In Stock
  • $0.00

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Electro-Bond 01 is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates. Electro-Bond 01 shows slight settling when stored for a long period of time, no caking and will re disperse to a smooth homogeneous state. Electro-Bond 01 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others. Electro-Bond 01 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, static shielding, connections, and circuitry."


Typical Properties

Components 1
Working Life @ 25°C 6 months
Hardness, Shore D 83
Particle Size 40
Shelf Life 6 months
Cure Type Heat Cure
Cure Schedule 2 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °C
Benefits
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry,
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry

Physical Properties

Appearance Silver
Filler Silver
Viscosity Paste
Substrates aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI 12000
Specific Gravity @ 25°C 2.79
Hardness 83
Lap Shear Strength 8700
Tensile Strength, PSI 8700

Electrical Properties

Volume Resistivity 1.70 E-04 ohm. cm

Thermal Properties

Thermal Conductivity @ 25 °C
Operating Temp from –50 to +170°C
Glass Transition Temp (Tg)
Thermal Expansion Coefficient, per °C 0.49
Heat Distortion, °C 175
Thermal Conductivity W/M-K 2.65
Thermal Conductivity BTU-IN/HR-FT²-°F 18.37

Tags: 1 part silver adhesive, conductive epoxy, conductive adhesives, Silver epoxy, silver epoxies, silver adhesive, silver adhesives, flexible conductive silver, flexible conductive adhesive