Electrically Conductive Silver Filled Epoxy Thermally Conductive Silver Adhesive 1 Part Heat Cure
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Electro-Bond 80 is one part Electrically Conductive Adhesives, used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditional methods such as solder, are not practical. Electrically Conductive Adhesives are ideal for attaching temperature sensitive components, or providing electrical interconnections on non-solderable substrates, such as plastic and glass.
Typical Properties |
|
| Components | 1 |
| Working Life @ 25°C | 6 months |
| Hardness, Shore D | 78 |
| Particle Size | 44 |
| Shelf Life | 6 months |
| Cure Type | Heat Cure |
| Cure Schedule | 1 hour @ 125°C / 15 minutes@ 150°C / 4 minutes @ 175°C |
| Benefits | |
| Formulated for electronics applications, for the assembly line manufacturing, for high RF shieldings. | |
| Typical Applications | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. | |
Physical Properties |
|
| Appearance | Silver |
| Filler | Silver |
| Viscosity | Paste |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 8,500 |
| Specific Gravity @ 25°C | 2.33 |
| Hardness | 78 |
| Lap Shear Strength | 840 |
| Reactive Solids Content, % | 100 |
| Tensile Strength, PSI | 3700 |
Electrical Properties |
|
| Volume Resistivity | <0.0005 ohm. cm |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +190°C |
| Glass Transition Temp (Tg) | 40°C |
| Thermal Expansion Coefficient, per °C | |
| Heat Distortion, °C | 175 |
| Thermal Conductivity W/M-K | 1.39 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 10.1 |
