High Heat Electrically Conductive Silver High Temp Resistant Thermally Conductive Adhesive
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- Brand: ConductiveX
- Product Code: Electro-Bond 24
- Availability: In Stock
- $0.00
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Electro-Bond 24 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperature range (Up to 190°C) are required. This smooth paste formulation of refined pure silver and epoxy is free of solvents and copper or carbon additives. It can be used -- after REQUIRED high temperature cure cycle -- for the assembly, manufacture and repair of electronic modules, printed circuits, integrated circuits, electrical contacts, capacitors, wave guides and flat cables, for high-frequency RF shieldings, and for applications where a "hot" soldering iron is impractical. Fully cured Electro-Bond 24 is a hard, dimensionally stable, conductive material which is resistant to water, weathering, gases and vapors, lubricants, fuels, alcohol, and also to those salts, salt solutions, mild acids and alkalis, and other organic and inorganic compounds with which silver itself is compatible.
Typical Properties |
|
Components | 2 |
Mix Ratio | 100/5 |
Working Life @ 25°C | 180 Minutes |
Hardness, Shore D | 84 |
Particle Size | Less than 2 Microns |
Shelf Life | 1 year |
Cure Type | Room Temp / Heat Cure |
Cure Schedule | 24 hours @ Room Temp 2 to 4 hours @ 60°C |
Benefits | |
For electronics applications, for the assembly line manufacturing, for high RF shieldings. | |
Typical Applications | |
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. | |
Physical Properties |
|
Appearance | Silver |
Filler | Silver |
Viscosity | Paste |
Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
Density @ 25°C | |
Compressive Strength, PSI | 3500 |
Specific Gravity @ 25°C | 2.63 |
Hardness | 84 |
Lap Shear Strength | 1270 |
Reactive Solids Content, % | 100 |
Shrinkage Linear, IN/IN | 0.003 |
Tensile Strength, PSI | 1270 |
Electrical Properties |
|
Volume Resistivity | 2.00 E-03 ohm. cm |
Thermal Properties |
|
Thermal Conductivity @ 25 °C | |
Operating Temp | from –50 to +190°C |
Glass Transition Temp (Tg) | 92 |
Thermal Expansion Coefficient, per °C | |
Heat Distortion, °C | 190 |
Thermal Conductivity W/M-K | 1.5 |
Thermal Conductivity BTU-IN/HR-FT²-°F | 10.4 |
Tags: conductive epoxy, conductive adhesives, Silver epoxy, silver epoxies, silver adhesive, silver adhesives, flexible conductive silver, flexible conductive adhesive