Flexible Electrically & Thermally Conductive Silver Epoxy, Flexible Electronic Component Repair

Flexible Electrically & Thermally Conductive Silver Epoxy,  Flexible Electronic Component Repair
  • Views: 48768
  • Brand: ConductiveX
  • Product Code: Electro-Bond 19
  • Availability: In Stock
  • $0.00

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Electro-Bond 19 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good electrical and mechanical properties. elector Bond 19 is two-part, smooth paste adhesive of refined pure silver and epoxy resin components. It is free of solvents and copper or carbon additives. It develops strong, durable, resilient, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic insulates.

Typical Properties

Components 2
Mix Ratio 90/100
Working Life @ 25°C 30 Minutes
Hardness, Shore D 78
Particle Size 25
Shelf Life 1 year
Cure Type Room Temp / Heat Cure
Cure Schedule 24 hours @ Room Temp 2 to 4 hours @ 60°C
For flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.

Physical Properties

Appearance Silver
Filler Silver
Viscosity Paste
Substrates aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI 3200
Specific Gravity @ 25°C 2.32
Hardness 78
Lap Shear Strength
Reactive Solids Content, % 100
Shrinkage Linear, IN/IN 0.003
Tensile Strength, PSI 2400

Electrical Properties

Volume Resistivity 1.00 E03 ohm. cm

Thermal Properties

Thermal Conductivity @ 25 °C
Operating Temp from –50 to +170°C
Glass Transition Temp (Tg) 30°C
Thermal Expansion Coefficient, per °C
Heat Distortion, °C 110
Thermal Conductivity W/M-K 1.5
Thermal Conductivity BTU-IN/HR-FT²-°F 10.6

Tags: conductive epoxy, conductive adhesives, Silver epoxy, silver epoxies, silver adhesive, silver adhesives, flexible conductive silver, flexible conductive adhesive