Thermally Conductive Epoxy Paste Low NASA Outgassing Adhesive Thixotropic Electrically Insulating
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Thermo-Bond 53 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. Thermo-Bond 53 is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. Thermo-Bond 53 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials. Thermo-Bond 53 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials.
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 100/7 |
| Working Life @ 25°C | 45 Minutes |
| Hardness, Shore D | 87 |
| Particle Size | 44 |
| Shelf Life | 1 year |
| Cure Type | Room Temp / Heat Cure |
| Cure Schedule | 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C |
| Benefits | |
| Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. | |
| Typical Applications | |
| Fibers optic, potting and connectors | |
Physical Properties |
|
| Appearance | Grey |
| Filler | Alumina |
| Viscosity | Paste |
| Substrates | metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials |
| Density @ 25°C | |
| Compressive Strength, PSI | 11000 |
| Specific Gravity @ 25°C | 2.45 |
| Hardness | 87 |
| Lap Shear Strength | 8200 |
| Reactive Solids Content, % | 100 |
| Tensile Strength, PSI | 8200 |
Electrical Properties |
|
| Volume Resistivity | 5.40 E+15 ohm. cm |
| Dielectric Constant | 6 |
| Dissipation Factor KV/IN | 410 |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +170°C |
| Glass Transition Temp (Tg) | 110 C |
| Thermal Expansion Coefficient, per °C | 14 |
| Heat Distortion, °C | 175 |
| Thermal Conductivity W/M-K | 1 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 6.92 |
