Thermally Conductive High Temperature Epoxy Adhesive Max 425F Heat Cure Low Viscosity
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Thermo-Bond 180 is designed for the fastest and most continuous high heat transfer. Thermo-Bond 180 measures several times faster heat dissipation than other commercial types. This system can be easily mixed and poured to form a dimensionally stable heat transfer package.
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 100/10 |
| Working Life @ 25°C | 90 Minutes |
| Hardness, Shore D | 90 |
| Particle Size | 44 |
| Shelf Life | 1 year |
| Cure Type | Heat Cure |
| Cure Schedule | 10 hours @ 175 °F 3 hours @ 225°F |
| Benefits | |
| Very long pot life, heat curing for large casting and those applications requiring optimum properties with operating temperature up 425F. | |
| Typical Applications | |
| Very long pot life heat curing for large casting and those applications requiring optimum properties with operating temperature up 425F | |
Physical Properties |
|
| Appearance | Black |
| Filler | Alumina |
| Viscosity | 55000 |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 15000 |
| Specific Gravity @ 25°C | 1.9 |
| Hardness | 90 |
| Lap Shear Strength | 8800 |
| Reactive Solids Content, % | 100 |
| Shrinkage Linear, IN/IN | 0.003 |
| Tensile Strength, PSI | 8800 |
Electrical Properties |
|
| Volume Resistivity | 1.5 E15 ohm. cm |
| Dielectric Constant | 4.4 |
| Dielectric Strength | 485 |
| Dissipation Factor KV/IN | 0.015 |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +150°C |
| Glass Transition Temp (Tg) | |
| Thermal Expansion Coefficient, per °C | 14 |
| Heat Distortion, °C | 175 |
| Thermal Conductivity W/M-K | 1.44 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 10 |
