Thermally Conductive Adhesive Electrically Insulating Epoxy Fast Cure Heat Sink Staking
- Views: 55914
- Brand: ConductiveX
- Product Code: Thermo-Bond 56
- Availability: In Stock
- $0.00
Available Options
Thermo-Bond 56 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards. Thermo-Bond 56 is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application.
Typical Properties |
|
Components | 2 |
Mix Ratio | 100/23 |
Working Life @ 25°C | 5 Minutes |
Hardness, Shore D | 78 |
Particle Size | 44 |
Shelf Life | 1 year |
Cure Type | Room Temp |
Cure Schedule | 60 minutes @ Room Temp |
Benefits | |
Fast Cure, Strong Bond, durable High Impact Bonds at room temperature. | |
Typical Applications | |
Fibers optic, potting and connectors | |
Physical Properties |
|
Appearance | Grey |
Filler | Alumina |
Viscosity | 12,000 |
Substrates | metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials |
Density @ 25°C | |
Compressive Strength, PSI | 10000 |
Specific Gravity @ 25°C | 2.25 |
Hardness | 78 |
Lap Shear Strength | 3400 |
Reactive Solids Content, % | 100 |
Tensile Strength, PSI | 3400 |
Electrical Properties |
|
Volume Resistivity | 5.40 E+15 ohm. cm |
Thermal Properties |
|
Thermal Conductivity @ 25 °C | |
Operating Temp | from –50 to +110°C |
Glass Transition Temp (Tg) | 33 C |
Thermal Expansion Coefficient, per °C | 14.4 |
Heat Distortion, °C | 160 |
Thermal Conductivity W/M-K | 0.84 |
Thermal Conductivity BTU-IN/HR-FT²-°F | 5.83 |
Tags: conductive epoxy, conductive adhesives, Alumina epoxy, Alumina epoxies, Alumina adhesive, Alumina adhesives, flexible conductive Alumina, flexible conductive adhesive