Pure Gold Paste Electrically and Thermally Conductive 2 Part Epoxy 24h Room Temp Cure

New Pure Gold Paste Electrically and Thermally Conductive 2 Part Epoxy 24h Room Temp Cure
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  • Brand: ConductiveX
  • Product Code: Electro-Bond G298
  • Availability: In Stock
  • $0.00

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AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.  This product is used in high-end medical and aerospace equipment to prevent cross-linking in high voltage / Amperage applications.

Benefits:

  • Gold filled epoxy allows for anti-oxidation of contacts and terminals in high reliability devices. 
  • It can be used in medical circuits using traditional hybrid packaging technologies. 
  • High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes.

Typical Applications:


  • Adhesive for joining die and SMDs onto the hybrid circuits. 
  • Repairing defective Au thick-film conductor traces and contact pads. 
  • Resisting oxidation and electro-migration in high-reliability microelectronics. 
  • Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300°C
 


Typical Properties

Components 2
Mix Ratio 100/4
Working Life @ 25°C 30 Minutes
Hardness, Shore D 87
Particle Size 50
Shelf Life 1 year in syringes and 3 months in pouches/bi-paks
Cure Type Room Temp or Heat Cure
Cure Schedule 15 minutes @ 120°C / 248 °F 90 minutes @ 80°C / 176 °F 10 hours @ 50°C / 122 °F 24 hours @ 25°C / 77 °F
Benefits
This product is used in high-end aerospace and medical equipment to prevent cross-linking in high voltage / Amperage applications.
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical

Physical Properties

Appearance Gold
Filler Gold
Viscosity Paste
Substrates aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Outgassing, NASA %CVCM 0
Compressive Strength, PSI 13000
Specific Gravity @ 25°C
Hardness 87
Lap Shear Strength 1000
Shrinkage Linear, IN/IN 0.003

Electrical Properties

Volume Resistivity @ 23°C: ≤ 0.0009 Ohm-cm ohm. cm
Dielectric Strength @ 23°C: ≥ 5 Kg / 1,700 psi

Thermal Properties

Thermal Conductivity @ 25 °C
Operating Temp from –50 to +130°C
Glass Transition Temp (Tg) ≥ 100°C (Dynamic Cure 20—200°C /ISO 25 Min; Ramp- 10—200°C @ 20°C/Min
Thermal Expansion Coefficient, per °C
Heat Distortion, °C 175

Tags: conductive gold, gold adhesives, gold epoxy, carbon epoxies, Gold adhesive, Gold paste, gold compound