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Electro-Bond F3 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel form..
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Thermo-bond 58 is a flexible, thermal conductive epoxy system. It is used for staking transistors, d..
Electro-Bond 63 is one component graphite fille epoxy designed for Esd/Emi Shielding of semiconducto..
Electro-Bond 62 is a two parts adhesives, graphite filled epoxy designed for Esd/Emi Shielding of se..
Electro-Bond 24 is a two part electrically conductive composition developed for low shrinkage, low ..
Electro-Bond 07 is an epoxy adhesive and coating formulation based on pure silver. This versatile si..
Electro-Bond 06 represents the newest technology since the introduction of electrically conductive s..
AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed f..
Electro-Bond 01 is a single component epoxy, formulated with pure silver powder combined with organ..
Electro-Bond G2 represents the newest technology since the introduction of electrically conductive s..
Thermo-Bond 180 is designed for the fastest and most continuous high heat transfer. Thermo-Bo..
Thermo-Bond 56 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for sta..
Thermo-Bond 90 is designed for the fastest and most continuous high heat transfer. Thermo-Bond 90 ..
Thermo-Bond 110 is flame retardant and is designed to meet the rigid requirement of UL-94-V0. ..
Thermo-Bond 53 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA ..