Pure Gold Paste Electrically and Thermally Conductive 2 Part Epoxy 24h Room Temp Cure
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- Brand: ConductiveX
- Product Code: Electro-Bond G298
- Availability: In Stock
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AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging. This product is used in high-end medical and aerospace equipment to prevent cross-linking in high voltage / Amperage applications.
Benefits:
- Gold filled epoxy allows for anti-oxidation of contacts and terminals in high reliability devices.
- It can be used in medical circuits using traditional hybrid packaging technologies.
- High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes.
Typical Applications:
- Adhesive for joining die and SMDs onto the hybrid circuits.
- Repairing defective Au thick-film conductor traces and contact pads.
- Resisting oxidation and electro-migration in high-reliability microelectronics.
- Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300°C
Typical Properties |
|
Components | 2 |
Mix Ratio | 100/4 |
Working Life @ 25°C | 30 Minutes |
Hardness, Shore D | 87 |
Particle Size | 50 |
Shelf Life | 1 year in syringes and 3 months in pouches/bi-paks |
Cure Type | Room Temp or Heat Cure |
Cure Schedule | 15 minutes @ 120°C / 248 °F 90 minutes @ 80°C / 176 °F 10 hours @ 50°C / 122 °F 24 hours @ 25°C / 77 °F |
Benefits | |
This product is used in high-end aerospace and medical equipment to prevent cross-linking in high voltage / Amperage applications. | |
Typical Applications | |
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical | |
Physical Properties |
|
Appearance | Gold |
Filler | Gold |
Viscosity | Paste |
Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
Density @ 25°C | |
Outgassing, NASA %CVCM | 0 |
Compressive Strength, PSI | 13000 |
Specific Gravity @ 25°C | |
Hardness | 87 |
Lap Shear Strength | 1000 |
Shrinkage Linear, IN/IN | 0.003 |
Electrical Properties |
|
Volume Resistivity | @ 23°C: ≤ 0.0009 Ohm-cm ohm. cm |
Dielectric Strength | @ 23°C: ≥ 5 Kg / 1,700 psi |
Thermal Properties |
|
Thermal Conductivity @ 25 °C | |
Operating Temp | from –50 to +130°C |
Glass Transition Temp (Tg) | ≥ 100°C (Dynamic Cure 20—200°C /ISO 25 Min; Ramp- 10—200°C @ 20°C/Min |
Thermal Expansion Coefficient, per °C | |
Heat Distortion, °C | 175 |
Tags: conductive gold, gold adhesives, gold epoxy, carbon epoxies, Gold adhesive, Gold paste, gold compound