Highly Conductive Pure Silver Epoxy Elecrically Conductive Adhesive Easy 1 to 1 Mix Ratio Dispensing

New Highly Conductive Pure Silver Epoxy Elecrically Conductive Adhesive Easy 1 to 1 Mix Ratio Dispensing
  • Views: 80293
  • Brand: ConductiveX
  • Product Code: Electro-Bond 07
  • Availability: In Stock
  • $0.00

Available Options

Electro-Bond 07 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm·cm. Electro-Bond 07 is also characterized by a wide operating temperature range from –50 to +170°C. Electro-Bond 07 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.


Typical Properties

Components 2
Mix Ratio 100/100
Working Life @ 25°C 45 Minutes
Hardness, Shore D 85
Particle Size 44
Shelf Life 1 year
Cure Type Room Temp / Heat Cure
Cure Schedule 24 hours @ Room Temp 2 to 4 hours @ 60°C
Benefits
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry.
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical

Physical Properties

Appearance Silver
Filler Silver
Viscosity Paste
Substrates aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI 13500
Specific Gravity @ 25°C 2.62
Hardness 85
Lap Shear Strength 1250
Reactive Solids Content, % 100
Shrinkage Linear, IN/IN 0.0029
Tensile Strength, PSI 9500

Electrical Properties

Volume Resistivity 1.00 E-03 ohm. cm
Dielectric Constant 4.1
Dielectric Strength 460

Thermal Properties

Thermal Conductivity @ 25 °C
Operating Temp From –50 To +170°C
Glass Transition Temp (Tg) 50
Thermal Expansion Coefficient, per °C 1.5
Heat Distortion, °C 170
Thermal Conductivity W/M-K 1.56
Thermal Conductivity BTU-IN/HR-FT²-°F 11.2

Tags: conductive epoxy, conductive adhesives, Silver epoxy, silver epoxies, silver adhesive, silver adhesives, flexible conductive silver, flexible conductive adhesive