Highly Conductive Pure Silver Epoxy Elecrically Conductive Adhesive Easy 1 to 1 Mix Ratio Dispensing
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Electro-Bond 07 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm·cm. Electro-Bond 07 is also characterized by a wide operating temperature range from –50 to +170°C. Electro-Bond 07 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 100/100 |
| Working Life @ 25°C | 45 Minutes |
| Hardness, Shore D | 85 |
| Particle Size | 44 |
| Shelf Life | 1 year |
| Cure Type | Room Temp / Heat Cure |
| Cure Schedule | 24 hours @ Room Temp 2 to 4 hours @ 60°C |
| Benefits | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry. | |
| Typical Applications | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical | |
Physical Properties |
|
| Appearance | Silver |
| Filler | Silver |
| Viscosity | Paste |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 13500 |
| Specific Gravity @ 25°C | 2.62 |
| Hardness | 85 |
| Lap Shear Strength | 1250 |
| Reactive Solids Content, % | 100 |
| Shrinkage Linear, IN/IN | 0.0029 |
| Tensile Strength, PSI | 9500 |
Electrical Properties |
|
| Volume Resistivity | 1.00 E-03 ohm. cm |
| Dielectric Constant | 4.1 |
| Dielectric Strength | 460 |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | From –50 To +170°C |
| Glass Transition Temp (Tg) | 50 |
| Thermal Expansion Coefficient, per °C | 1.5 |
| Heat Distortion, °C | 170 |
| Thermal Conductivity W/M-K | 1.56 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 11.2 |
