Silver Filled Epoxy Adhesive, Electrically Conductive Adhesive, Circuit Repair, 1 Part Heat Cure
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- Brand: ConductiveX
- Product Code: Electro-Bond 01
- Availability: In Stock
- $0.00
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Electro-Bond 01 is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates. Electro-Bond 01 shows slight settling when stored for a long period of time, no caking and will re disperse to a smooth homogeneous state. Electro-Bond 01 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others. Electro-Bond 01 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, static shielding, connections, and circuitry."
Typical Properties |
|
Components | 1 |
Working Life @ 25°C | 6 months |
Hardness, Shore D | 83 |
Particle Size | 40 |
Shelf Life | 6 months |
Cure Type | Heat Cure |
Cure Schedule | 2 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °C |
Benefits | |
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry, | |
Typical Applications | |
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry | |
Physical Properties |
|
Appearance | Silver |
Filler | Silver |
Viscosity | Paste |
Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
Density @ 25°C | |
Compressive Strength, PSI | 12000 |
Specific Gravity @ 25°C | 2.79 |
Hardness | 83 |
Lap Shear Strength | 8700 |
Tensile Strength, PSI | 8700 |
Electrical Properties |
|
Volume Resistivity | 1.70 E-04 ohm. cm |
Thermal Properties |
|
Thermal Conductivity @ 25 °C | |
Operating Temp | from –50 to +170°C |
Glass Transition Temp (Tg) | |
Thermal Expansion Coefficient, per °C | 0.49 |
Heat Distortion, °C | 175 |
Thermal Conductivity W/M-K | 2.65 |
Thermal Conductivity BTU-IN/HR-FT²-°F | 18.37 |

Tags: 1 part silver adhesive, conductive epoxy, conductive adhesives, Silver epoxy, silver epoxies, silver adhesive, silver adhesives, flexible conductive silver, flexible conductive adhesive