Electrically & Thermally Conductive 1 Part Silver Epoxy Heat Cure High Temp 325F

Electrically & Thermally Conductive 1 Part Silver Epoxy Heat Cure High Temp 325F
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  • Product Code: Electro-Bond 004
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Electro-Bond 04 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid processing and assembly. Electro-Bond 04 passes NASA’s outgassing testing (ASTM E-595) and is listed in NASA’s Outgassing Data for Selecting Spacecraft Materials list.Electro-Bond 04 offers excellent mechanical, electrical, and physical properties at continuous operating temperatures Up to 175°C. This versatile silver conductive adhesive can be used for chip bonding in micro and opto-electronic hybrid circuit fabrication. This high performance conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures Up to 325°F."


Typical Properties

Components 1
Working Life @ 25°C 6 months
Hardness, Shore D 87
Particle Size 17
Shelf Life 6 months
Cure Type Heat Cure
Cure Schedule 2 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °C
Benefits
Microwave Applications for EMI and RFI shielding, for assembly and repair of circuit boards and electronic components manufacturing .
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry

Physical Properties

Appearance Silver
Filler Silver
Viscosity Paste
Substrates aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Outgassing, NASA %CVCM 0.01
Outgassing, NASA %TML 0.38
Outgassing, NASA %WVR 0.07
Compressive Strength, PSI 12000
Specific Gravity @ 25°C 2.69
Hardness 87
Lap Shear Strength 8500
Reactive Solids Content, % 100
Tensile Strength, PSI 8500

Electrical Properties

Volume Resistivity 1.00 E-03 ohm. cm

Thermal Properties

Thermal Conductivity @ 25 °C
Operating Temp from –50 to +204°C
Glass Transition Temp (Tg)
Thermal Expansion Coefficient, per °C 0.49
Heat Distortion, °C 175
Thermal Conductivity W/M-K 2.99
Thermal Conductivity BTU-IN/HR-FT²-°F 20.74

Tags: conductive epoxy, conductive adhesives, Silver epoxy, Silver epoxies, Silver adhesive, Silver adhesives, conductive silver