Low Cost Silver Epoxy, Electrically Conductive Adhesive, EMI RFI Sheilding System

Electro-Bond 06 represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated ceramic that results in lower material costs without adversely sacrificingthe properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of conventional silver conductive. Electro-Bond 06 cures at room tem perature or can be accelerated with mild heat to form a tenacious bond between similar anddissimilar substrates such as aluminum, copper, magnesium, steel, bronze nickel, ceramic, glass, phenolic, and G-10 epoxy glass boards. because of its excellent continuity, has been used extensively in such diversified applications as, microwave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry and as a cold solder. This unique formulation offers ease in handling due to its creamy consistency and versatile application by hand, automatic dispenser, silk-screening, transfer or stamping techniques. "

Typical Properties
Components	2
Mix Ratio	100/5
Working Life @ 25°C	60 Minutes
Particle Size	40
Shelf Life	1 year
Cure Type	Room Temp / Heat Cure
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical
Physical Properties
Appearance	Silver
Filler	Silver
Viscosity	Paste
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI	13700
Specific Gravity @ 25°C	2.59
Hardness	83
Lap Shear Strength	8500
Reactive Solids Content, %	100
Shrinkage Linear, IN/IN	0.004
Tensile Strength, PSI	8900
Electrical Properties
Volume Resistivity	1.70 E-03 ohm. cm
Thermal Properties
Operating Temp	from –50 to +130°C
Glass Transition Temp (Tg)	60
Thermal Expansion Coefficient, per °C	0.49
Heat Distortion, °C	90
Thermal Conductivity W/M-K	18.37
Thermal Conductivity BTU-IN/HR-FT²-°F	18.37