Technical Datasheets


Product Components Base Price Cure Type Mix Ratio Working Life Shelf Life Appearance Filler Base Fluid Benefits Bleeding Compressive Strength Cure Schedule Density Dielectric Constant Dielectric Strength Dissipation Factor Evaporation Glass Transition Temp Hardness Heat Distortion Lap Shear Strength Operating Temp Outgassing, CVCM Outgassing, TML Outgassing, WVR Particle Size Penetration Potential Uses Press Flow Reactive Solids Shrinkage Linear Specific Gravity Substrates Tensile Strength Thermal Conductivity, WMK Thermal Conductivity, BTU Thermal Expansion Coefficient Typical Applications Viscosity Volume Resistivity TDS
Electro-Bond 612$9.99 Room Temp / Heat Cure100/1030 Minutes 1 YearBlackCarbonN/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry N/A1200024 hours @ Room Temp 2 to4 hours @ 60°CN/AN/AN/AN/AN/A30°C801001850from –50 to +100°CN/AN/AN/A25N/AN/AN/A1000.0031.18aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board35000.251.8N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.Paste< 40TDS
Electro-Bond 132$9.99 Room Temp / Heat Cure100/1030 Minutes1 YearGreySilver/Copper N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry N/A350024 hours @ Room Temp 2 to 4 hours @ 60°CN/A4.24100.015N/A60°C801509400from –50 to +170°CN/AN/AN/A45N/AN/AN/A1000.0032.32aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board16501.15830EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.Paste3.70 E-2TDS
Electro-Bond 0041$18.99 Heat CureN/A6 Months6 MonthsSilverSilver N/AMicrowave Applications for EMI and RFI shielding, for assembly and repair of circuit boards and electronic components manufacturing .N/A120002 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °CN/AN/AN/AN/AN/AN/A871758500from –50 to +204°C0.010.380.0717N/AN/AN/A100N/A2.69aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board85002.9920.740.49EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry Paste 1.00 E-03TDS
Electro-Bond 022$18.99 Room Temp / Heat Cure100/560 Minutes1 YearSilverSilverN/AFormulated for high strength application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.N/A1300024 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°CN/AN/AN/AN/AN/A60°C851751000from –50 to +130°C00.620.1317N/AN/AN/A1000.0032.79aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board94002.9920.730.49EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.Paste1.00 E-03TDS
Electro-Bond 02LP2$18.99 Room Temp / Heat Cure100/6180 Minutes1 Year SilverSilver N/ADesigned for high strength application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.N/A1300024 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°CN/AN/AN/AN/AN/A60°C871751000from –50 to +130°C00.610.1317N/AN/AN/A1000.0032.79aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board94002.9920.730.49EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impracticalPaste 1.00 E-03TDS
Electro-Bond 032$9.99 Room Temp / Heat Cure100/560 Minutes1 Year GreyNickelN/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.N/A1350024 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C N/AN/AN/AN/AN/A60°C851308500from –50 to +170°CN/AN/AN/A40N/AN/AN/A1000.0032.69aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board89001.44100.45EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.Paste<0.038TDS
Electro-Bond 791$18.99 Heat CureN/A3 Months3 MonthsSilver Silver N/ADesigned for electronics applications, for the assembly line manufacturing, for high RF shieldings.N/A3600N/AN/AN/AN/AN/AN/A45°C851501720from –50 to +150°CN/AN/AN/A44N/AN/AN/A100N/A2.62aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board17201.4510.3N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.Paste3.00 E -3TDS
Electro-Bond 201$18.99 Heat CureN/A6 Months6 MonthsSilver Silver N/AIntended for electronics applications, for the assembly line manufacturing, for high RF shieldings.N/A9,000N/AN/AN/AN/AN/AN/A42°C80170900from –50 to +170°CN/AN/AN/A44N/AN/AN/A100N/A2.61aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board3,5001.4310.2N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.Paste3.00 E-4TDS
Electro-Bond X12$19.99 Room Temperature100/56 Minutes6 MonthsSilverSilver N/ADesigned For fast cure rear Window Defroster, Grid Repair and Tab adhesives.N/A134004 hours @ Room Temp 10 minutes @ 60 °CN/AN/AN/AN/AN/A6083959400From -20 to +200°FN/AN/AN/A44N/AN/AN/A1000.0032.64Glas, aluminum, Steel Bronze and ceramic 22001.4610N/ABack Glass Defroster power tab antenna repair and electrically conductive components repair.Paste1.00 E-03TDS
Electro-Bond 801$18.99 Heat CureN/A6 Months6 MonthsSilver Silver N/AFormulated for electronics applications, for the assembly line manufacturing, for high RF shieldings.N/A8,500cure_scheduleN/AN/AN/AN/AN/A40°C78175840from –50 to +190°CN/AN/AN/A44N/AN/AN/A100N/A2.33aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board37001.3910.1N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.Paste<0.0005TDS
Thermo-Grease FDA 71$9.99 Grease N/AN/A2 YearsOff White Zinc OxideFDA SiliconeN/A0N/A-40 to 190N/A4.4390N/A0N/AN/AN/AN/AN/AN/AN/AN/AN/AN/AThermal coupler for any heat sink device temperature sensors, power transistors, thermal joints, for any device where efficient cooling is required.15N/AN/A2.5N/AN/A0.9N/AN/AThermal coupler for any heat sink device temperature sensors, power transistors, thermal joints, for any device where efficient cooling is required.Paste2.9 E+14TDS
Electro-Bond F642$9.99 Room Temp / Heat Cure100/10090 Minutes1 Year Black CarbonN/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry.N/A650024 hours @ Room Temp 2 to 4 hours @ 60°CN/AN/AN/AN/AN/A25°C601502600from –50 to +150°CN/AN/AN/A25N/AN/AN/A1000.0031.35aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board16500.241.6N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.Paste<40TDS
Electro-Bond 142$9.99 Room Temp / Heat Cure90/10045 Minutes1 YearGreySilver/Copper N/ADesigned for flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.N/A300024 hours @ Room Temp 2 to 4 hours @ 60°CN/A4.14100.015N/A60°C601499400from –50 to +170°CN/AN/AN/A45N/AN/AN/A1000.0032.32aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board12401.168.130EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.Paste3.60 E+5TDS
Electro-Bond 192$18.99 Room Temp / Heat Cure 90/10030 Minutes1 Year Silver Silver N/AFor flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.N/A320024 hours @ Room Temp 2 to 4 hours @ 60°CN/AN/AN/AN/AN/A30°C78110N/Afrom –50 to +170°CN/AN/AN/A25N/AN/AN/A1000.0032.32aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board24001.510.6N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.Paste1.00 E03TDS
Electro-Bond 162$18.99 Room Temp / Heat Cure100/11590 Minutes1 Year Silver Silver N/ADesigned for flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.N/A450024 hours @ Room Temp 2 to 4 hours @ 60°CN/AN/AN/AN/AN/A3064110N/Afrom –50 to +170°CN/AN/AN/A17N/AN/AN/A1000.0032.85aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board35001.4910.3N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impracticalPaste1.00 E03TDS
Electro-Bond 242$18.99 Room Temp / Heat Cure100/5180 Minutes1 YearSilver Silver N/AFor electronics applications, for the assembly line manufacturing, for high RF shieldings.N/A350024 hours @ Room Temp 2 to 4 hours @ 60°CN/AN/AN/AN/AN/A92841901270from –50 to +190°CN/AN/AN/A44N/AN/AN/A1000.0032.63aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board12701.510.4N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.Paste2.00 E-03TDS
Electro-Bond 172$1.99 Room Temp / Heat Cure100/10060 Minutes1 YearSilver Silver N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry.N/A650024 hours @ Room Temp 2 to 4 hours @ 60°CN/A4410N/AN/A3563170850from –50 to +140°CN/AN/AN/A44N/AN/AN/A1000.00162.46aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board12401.52111.4EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.Paste1.00 E-03TDS
Electro-Bond F3 2$9.99 Room Temp / Heat Cure100/1590 Minutes1 YearNickelNickel N/ADesigned for flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.N/A320024 hours @ Room Temp 2 to 4 hours @ 60°CN/AN/AN/AN/AN/A60651251300from –50 to +150°CN/AN/AN/A44N/AN/AN/A1000.0032.79aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board12501.4410N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.Paste<0.004TDS
Thermo-Bond 582$9.99 Room Temp / Heat Cure100/382 Hours 1 YearGreyAlumina N/AStaking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.N/A850024 hours @ Room Temp 2 to 4 hours @ 60°CN/A6410N/AN/AN/A601251850from –50 to +125°CN/AN/AN/A44N/AN/AN/A100N/A2.3metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials35000.82N/AN/AStaking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boardsPaste2.0 E+15TDS
Electro-Bond 63 1$9.99 Heat CureN/A6 Months6 MonthsGreyGraphite N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry N/A110001 hour @ 120 C N/AN/AN/AN/AN/AN/A801702600from –50 to +170°CN/AN/AN/A25N/AN/AN/A1000.0031.28aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board36000.251.7N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.Paste43TDS
Electro-Bond 622$9.99 Room Temp / Heat Cure100/1040 Minutes 1 YearGreyGraphite N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry,N/A1100024 hours @ Room Temp 2 to 4 hours @ 60°CN/AN/AN/AN/AN/A30781002300from –50 to +110°CN/AN/AN/A25N/AN/AN/A1000.0031.29aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board34000.241.7N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.Paste0.004TDS
Electro-Bond 072$1.99 Room Temp / Heat Cure100/10045 Minutes1 YearSilver Silver N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry.N/A1350024 hours @ Room Temp 2 to 4 hours @ 60°CN/A4.1460N/AN/A50851701250From –50 To +170°CN/AN/AN/A44N/AN/AN/A1000.00292.62aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board95001.5611.21.5EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impracticalPaste 1.00 E-03TDS
Electro-Bond 062$9.99 Room Temp / Heat Cure100/560 Minutes1 Year SilverSilver N/AFor high strength application, electrical properties, perfect bond, cold solder for heat sensitive components.N/A1370024 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°CN/AN/AN/AN/AN/A6083908500from –50 to +130°CN/AN/AN/A40N/AN/AN/A1000.0042.59aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board890018.3718.370.49EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impracticalPaste 1.70 E-04TDS
Electro-Bond 011$18.99 Heat CureN/A6 Months6 MonthsSilverSilver N/AEMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry,N/A120002 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °CN/AN/AN/AN/AN/AN/A831758700from –50 to +170°CN/AN/AN/A40N/AN/AN/AN/AN/A2.79aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board87002.6518.370.49EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry Paste1.70 E-04TDS
Electro-Bond G21$9.99 Heat CureN/A6 Months6 MonthsSilverSilver N/ADesigned for high strength application, electrical properties with perfect bonding.N/A120002 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °CN/AN/AN/AN/AN/AN/A831758700from –50 to +204°CN/AN/AN/A40N/AN/AN/A2.59N/A2.59aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board87002.6518.370.49EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry Paste1.70 E-04TDS
Thermo-Bond 542$9.99 Heat Cure / Room Temp Cure100/63 Hours 1 YearGreyAlumina N/AStaking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.N/A65002 hrs @ 65°C +1hr @ 130 °C 2 hrs @ 65°C +2 hrs @100°C 48 hrs @ Room TempN/A6425N/AN/A130941302000from –50 to +160°CN/AN/AN/A44N/AN/AN/A10010.12.43metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials320016.94N/AStaking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards1200005.00 E+15TDS
Thermo-Bond 1802$9.99 Heat Cure100/1090 Minutes1 YearBlackAluminaN/AVery long pot life, heat curing for large casting and those applications requiring optimum properties with operating temperature up 425F.N/A1500010 hours @ 175 °F 3 hours @ 225°FN/A4.44850.015N/AN/A901758800from –50 to +150°CN/AN/AN/A44N/AN/AN/A1000.0031.9aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board88001.441014Very long pot life heat curing for large casting and those applications requiring optimum properties with operating temperature up 425F 550001.5 E15TDS
Thermo-Bond 562$9.99 Room Temp100/235 Minutes 1 YearGreyAlumina N/AFast Cure, Strong Bond, durable High Impact Bonds at room temperature.N/A1000060 minutes @ Room TempN/AN/AN/AN/AN/A33 C781603400from –50 to +110°CN/AN/AN/A44N/AN/AN/A100N/A2.25metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials34000.845.8314.4Fibers optic, potting and connectors 12,0005.40 E+15TDS
Thermo-Bond 902$9.99 Room Temp100/590 Minutes 1 YearBlackAluminaN/AShorter pot life, fast room temperature curative for casting Up to 1.5 inches thick and operating temperature Up to 300 F N/A150008 hours @ Room Temp 2 hours @ 60 °CN/A4.44850.015N/AN/A901758800from –50 to +150°CN/AN/AN/A44N/AN/AN/A1000.0031.9aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board88001.00N/A14Shorter pot life fast room temperature curative for casting Up to 1.5 inches thick and operating temperature Up to 300 F 550001.50 E15TDS
Thermo-Bond 1102$9.99 Room Temp100/52 Hours1 YearBlackAluminaN/AFormulated to meet those applications which require electrical, physical and thermal properties with a service temperature Up to 205CN/A1700010 hours @ 175 °F 3 hours @ 225°FN/A6.45600.018N/AN/A921758500from –50 to +205°CN/AN/AN/A44N/AN/AN/A1000.0012.3aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board85001.6611.530is designed to meet those applications which require electrical, physical and thermal properties with a service temperature Up to 205C30004.90E+16TDS
Thermo-Bond 532$9.99 Room Temp / Heat Cure100/745 Minutes 1 Year GreyAlumina N/AStaking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.N/A1100024 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°CN/A6N/A410N/A110 C871758200from –50 to +170°CN/AN/AN/A44N/AN/AN/A100N/A2.45metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials820016.9214Fibers optic, potting and connectors Paste5.40 E+15TDS
Thermo-Bond 1002$9.99 Room Temp100/1590 Minutes 1 YearBlackAluminaN/ALong pot life, low exothermic, room temprature curative for casting Up to 3 inches thick and operating temperature Up to 275F N/A1500024 Hours @ Room Temp 3 hours @ 65 °C N/A4.44850.015N/AN/A901758800from –50 to +135°CN/AN/AN/A44N/AN/AN/A1000.0031.9aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board88001.44btu14long pot life low exothermic room temperature curative for casting Up to 3 inches thick and operating temperature Up to 275F 550001.5 E5TDS
Thermo-Bond 812$9.99 Room Temp100/1090 Minutes1 YearBlackAluminaN/ALong pot life, low exothermic room temperature curative for casting Up to 6 inches thick and operating temperature Up to 250F.N/A1500024 hours @ Room Temp 3 hours @ 65 °C N/A4.44850.015N/AN/A901758800from –50 to +125°CN/AN/AN/A44N/AN/AN/A1000.0031.9aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board88001.441014long pot life low exothermic room temperature curative for casting Up to 6 inches thick and operating temperature Up to 250F 550001.5 E15TDS
Thermo-Bond 142$9.99 Room Temp / Heat Cure100/108 Hours2 YearAluminum AluminumN/ACasting synthetic metals molds, dies and tools. very low shrinkage .N/A3200024 hours @ Room Temp 2 to 4 hours @ 60°CN/AN/AN/AN/AN/A125851251650from –50 to +205°CN/AN/AN/A44N/AN/AN/A1000.00062.11aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board150001.38.9N/Atooling, casting 1200005.00E+10TDS
Thermo-Bond 952$9.99 Room Temp / Heat Cure100/1560 Minutes 1 YearOff White Boron NitrideN/AIntended for electronics applications, for the assembly line manufacturing, Heat Transfers components.N/A650024 hours @ Room Temp 2 to 4 hours @ 60°CN/AN/AN/AN/AN/A54801751250from –50 to +170°C0.020.6N/A45N/AN/AN/A1000.0031.30aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board34000.463.2N/AStaking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boardsPaste3.4 E+15TDS
Thermo-Bond 262$9.99 Room Temp / Heat Cure100/1450 Minutes1 YearGreyAluminaN/ADesigned for electronics applications, for the assembly line manufacturing, Heat Transfers components.N/A9,50025 hours @ Room Temp 2 to 4 hours @ 60°CN/AN/A410N/AN/A113821701750from –50 to +135°CN/AN/AN/A45N/AN/AN/A1000.00122.35aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board17500.463.2N/AStaking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boardsPaste3.4 E+15TDS
Thermo-Bond 122$9.99 Room Temp100/430 Minutes1 YearBlackAluminaN/ADesigned for applications requiring room temperature curing, will remain rigid Up to service temperature of 150C.N/A1700024 hours @ Room Temp 3 hours @ 65 °C N/A6.45600.018N/AN/A921758500from –50 to +150°CN/AN/AN/A44N/AN/AN/A1000.0012.3aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board85001.6611.530is designed for applications requiring room temperature curing, will remain rigid Up to service temperature of 150C900004.90E+16TDS
Thermo-Bond 242$9.99 Room Temp100/730 Minutes1 YearBlackAluminaN/ADesigned for applications requiring room temperature curing, lowest viscosity and best handling properties with a service temperature Up to 150C. Will soften slightly above 121C.N/A1700024 hours @ Room Temp 3 hours @ 65 °C N/A6.45600.018N/AN/A921758500from –50 to +150°CN/AN/AN/A44N/AN/AN/A1000.0012.3aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board85001.6611.530is designed for applications requiring room temperature curing, lowest viscosity and best handling properties with a service temperature Up to 150C. Will soften slightly above 121C150004.90 E16TDS
Thermo-Grease 04N/A$9.99N/AN/AN/A2 YearsOff WhiteZinc OxideSiliconeN/A0N/Acure_scheduleN/A4.4390N/A0N/AN/AN/AN/A-40 to 190°CN/AN/AN/AN/AN/AThermal coupler for any heat sink device temperature sensors, power transistors, thermal joints, for any device where efficient cooling is required.15N/AN/A2.46N/AN/A0.9N/AN/AN/APaste2.9 E+14TDS
Thermo-Bond 512$9.99 Room Temp / Heat Cure100/940 Minutes1 YearGreyAlumina N/AStaking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.N/A1000024 hours @ Room Temp 3 hours @ 65°CN/AN/AN/AN/AN/A60891157500from –50 to +125°CN/AN/AN/A44N/AN/AN/A1000.0032.3Metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials75006.520.9214.4Fibers optic, potting and connectors40,0002.10 E+15TDS
ConductiveX Repair Kit2$1.99 Room Temperature 100/56 Minutes 6 MonthsSilverSilver N/ADesigned For fast cure rear Window Defroster, Grid Repair and Tab adhesives.N/A134004 hours @ Room Temp 10 minutes @ 60 °CN/AN/AN/AN/AN/A6083959400From -20 to +200°FN/AN/AN/A44N/AN/AN/A1000.0032.64Glass, aluminum, Steel Bronze and ceramic 22001.4610N/ABack Glass Defroster power tab antenna repair and electrically conductive components repair.Paste 1.00 E-03TDS