Technical Datasheets

Product	Components	Base Price	Cure Type	Mix Ratio	Working Life	Shelf Life	Appearance	Filler	Base Fluid	Benefits	Bleeding	Compressive Strength	Cure Schedule	Density	Dielectric Constant	Dielectric Strength	Dissipation Factor	Evaporation	Glass Transition Temp	Hardness	Heat Distortion	Lap Shear Strength	Operating Temp	Outgassing, CVCM	Outgassing, TML	Outgassing, WVR	Particle Size	Penetration	Potential Uses	Press Flow	Reactive Solids	Shrinkage Linear	Specific Gravity	Substrates	Tensile Strength	Thermal Conductivity, WMK	Thermal Conductivity, BTU	Thermal Expansion Coefficient	Typical Applications	Viscosity	Volume Resistivity	TDS
Electro-Bond 61	2	$9.99	Room Temp / Heat Cure	100/10	30 Minutes	1 Year	Black	Carbon	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry	N/A	12000	24 hours @ Room Temp 2 to4 hours @ 60°C	N/A	N/A	N/A	N/A	N/A	30°C	80	100	1850	from –50 to +100°C	N/A	N/A	N/A	25	N/A	N/A	N/A	100	0.003	1.18	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	3500	0.25	1.8	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.	Paste	< 40	TDS
CoC	N/A	$9.99	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	TDS
Electro-Bond 13	2	$9.99	Room Temp / Heat Cure	100/10	30 Minutes	1 Year	Grey	Silver/Copper	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry	N/A	3500	24 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	4.2	410	0.015	N/A	60°C	80	150	9400	from –50 to +170°C	N/A	N/A	N/A	45	N/A	N/A	N/A	100	0.003	2.32	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	1650	1.15	8	30	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.	Paste	3.70 E-2	TDS
Electro-Bond 004	1	$19.99	Heat Cure	N/A	6 Months	6 Months	Silver	Silver	N/A	Microwave Applications for EMI and RFI shielding, for assembly and repair of circuit boards and electronic components manufacturing .	N/A	12000	2 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °C	N/A	N/A	N/A	N/A	N/A	N/A	87	175	8500	from –50 to +204°C	0.01	0.38	0.07	17	N/A	N/A	N/A	100	N/A	2.69	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	8500	2.99	20.74	0.49	EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry	Paste	1.00 E-03	TDS
Electro-Bond 02	2	$18.99	Room Temp / Heat Cure	100/5	60 Minutes	1 Year	Silver	Silver	N/A	Formulated for high strength application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.	N/A	13000	24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C	N/A	N/A	N/A	N/A	N/A	60°C	85	175	1000	from –50 to +130°C	0	0.62	0.13	17	N/A	N/A	N/A	100	0.003	2.79	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	9400	2.99	20.73	0.49	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.	Paste	6.00 E-04	TDS
Electro-Bond 02LP	2	$18.99	Room Temp / Heat Cure	100/6	180 Minutes	1 Year	Silver	Silver	N/A	Designed for high strength application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.	N/A	13000	24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C	N/A	N/A	N/A	N/A	N/A	60°C	87	175	1000	from –50 to +130°C	0	0.61	0.13	17	N/A	N/A	N/A	100	0.003	2.79	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	9400	2.99	20.73	0.49	EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical	Paste	6.00 E-04	TDS
Electro-Bond 03	2	$9.99	Room Temp / Heat Cure	100/5	60 Minutes	1 Year	Grey	Nickel	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.	N/A	13500	24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C	N/A	N/A	N/A	N/A	N/A	60°C	85	130	1100	from –50 to +170°C	N/A	N/A	N/A	40	N/A	N/A	N/A	100	0.003	2.69	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	8900	1.44	10	0.45	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.	Paste	<0.038	TDS
Electro-Bond 79	1	$18.99	Heat Cure Only	N/A	3 Months	3 Months	Silver	Silver	N/A	Designed for electronics applications, for the assembly line manufacturing, for high RF shieldings.	N/A	3600	2 hours @ 125°C \| 1 hour @ 150°C \| 1/2 hours @ 175°C	N/A	N/A	N/A	N/A	N/A	45°C	85	150	1720	from –50 to +150°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	N/A	2.62	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	1720	1.45	10.3	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.	Paste	3.00 E -3	TDS
Electro-Bond 20	1	$18.99	Heat Cure	N/A	6 Months	6 Months	Silver	Silver	N/A	Intended for electronics applications, for the assembly line manufacturing, for high RF shieldings.	N/A	9,000	1 hour @ 120 °C 15 min @ 150 °C 4 min @ 175 °C	N/A	N/A	N/A	N/A	N/A	42°C	80	170	900	from –50 to +170°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	N/A	2.61	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	3,500	1.43	10.2	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.	Paste	3.00 E-4	TDS
Electro-Bond X1	2	$19.99	Room Temperature	100/5	6 Minutes	6 Months	Silver	Silver	N/A	Designed For fast cure rear Window Defroster, Grid Repair and Tab adhesives.	N/A	13400	4 hours @ Room Temp 10 minutes @ 60 °C	N/A	N/A	N/A	N/A	N/A	60	83	95	9400	From -20 to +200°F	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.003	2.64	Glas, aluminum, Steel Bronze and ceramic	2200	1.46	10	N/A	Back Glass Defroster power tab antenna repair and electrically conductive components repair.	Paste	1.00 E-03	TDS
Electro-Bond 80	1	$18.99	Heat Cure	N/A	6 Months	6 Months	Silver	Silver	N/A	Formulated for electronics applications, for the assembly line manufacturing, for high RF shieldings.	N/A	8,500	1 hour @ 125°C / 15 minutes@ 150°C / 4 minutes @ 175°C	N/A	N/A	N/A	N/A	N/A	40°C	78	175	840	from –50 to +190°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	N/A	2.33	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	3700	1.39	10.1	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.	Paste	<0.0005	TDS
Thermo-Grease FDA 7	1	$9.99	Grease	N/A	N/A	2 Years	Off White	Zinc Oxide	FDA Silicone	N/A	0	N/A	-40 to 190	N/A	4.4	390	N/A	0	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	Thermal coupler for any heat sink device temperature sensors, power transistors, thermal joints, for any device where efficient cooling is required.	15	N/A	N/A	2.5	N/A	N/A	0.9	N/A	N/A	Thermal coupler for any heat sink device temperature sensors, power transistors, thermal joints, for any device where efficient cooling is required.	Paste	2.9 E+14	TDS
Electro-Bond F64	2	$1.99	Room Temp / Heat Cure	100/100	90 Minutes	1 Year	Black	Carbon	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, most rubbers and circuitry.	N/A	6500	24 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	N/A	N/A	N/A	N/A	25°C	60	150	2600	from –50 to +150°C	N/A	N/A	N/A	25	N/A	N/A	N/A	100	0.003	1.35	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board, most rubbers	1650	0.24	1.6	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.	Paste	<40	TDS
Electro-Bond 14	2	$9.99	Room Temp / Heat Cure	100/15	45 Minutes	1 Year	Grey	Silver/Copper	N/A	Designed for flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive semiconductor components. It is also a great option for die attach applications.	N/A	3000	24 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	4.1	410	0.015	N/A	60°C	60	149	9400	from –50 to +170°C	N/A	N/A	N/A	45	N/A	N/A	N/A	100	0.003	2.32	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	1240	1.16	8.1	30	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.	Paste	3.60 E+5	TDS
Electro-Bond 19	2	$18.99	Room Temp / Heat Cure	90/100	30 Minutes	1 Year	Silver	Silver	N/A	For flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.	N/A	3200	24 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	N/A	N/A	N/A	N/A	30°C	78	110	N/A	from –50 to +170°C	N/A	N/A	N/A	25	N/A	N/A	N/A	100	0.003	2.32	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	2400	1.5	10.6	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.	Paste	1.00 E03	TDS
Electro-Bond 16	2	$18.99	Room Temp / Heat Cure	100/115	90 Minutes	1 Year	Silver	Silver	N/A	Designed for flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.	N/A	4500	24 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	N/A	N/A	N/A	N/A	30	64	110	N/A	from –50 to +170°C	N/A	N/A	N/A	17	N/A	N/A	N/A	100	0.003	2.85	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	3500	1.49	10.3	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical	Paste	1.00 E03	TDS
Electro-Bond 17	2	$1.99	Room Temp / Heat Cure	100/100	60 Minutes	1 Year	Silver	Silver	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry.	N/A	6500	24 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	4	410	N/A	N/A	35	63	170	850	from –50 to +140°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.0016	2.46	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	1240	1.52	11	1.4	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.	Paste	1.00 E-03	TDS
Electro-Bond F3	2	$9.99	Room Temp / Heat Cure	100/15	90 Minutes	1 Year	Nickel	Nickel	N/A	Designed for flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.	N/A	3200	24 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	N/A	N/A	N/A	N/A	60	65	125	1300	from –50 to +150°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.003	2.79	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	1250	1.44	10	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.	Paste	<0.004	TDS
Thermo-Bond 58	2	$9.99	Room Temp / Heat Cure	100/38	2 Hours	1 Year	Grey	Alumina	N/A	Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.	N/A	8500	24 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	6	410	N/A	N/A	N/A	60	125	1850	from –50 to +125°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	N/A	2.3	metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials	3500	0.82	N/A	N/A	Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards	Paste	2.0 E+15	TDS
Electro-Bond 63	1	$9.99	Heat Cure	N/A	6 Months	6 Months	Grey	Graphite	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry	N/A	11000	1 hour @ 120 C	N/A	N/A	N/A	N/A	N/A	N/A	80	170	2600	from –50 to +170°C	N/A	N/A	N/A	42 Micron	N/A	N/A	N/A	100	0.003	1.28	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	3600	0.25	1.7	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.	Paste	43	TDS
Electro-Bond 62	2	$9.99	Room Temp / Heat Cure	100/10	40 Minutes	1 Year	Grey	Graphite	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry,	N/A	11000	24 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	N/A	N/A	N/A	N/A	30	78	100	2300	from –50 to +110°C	N/A	N/A	N/A	42 Micron	N/A	N/A	N/A	100	0.003	1.29	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	3400	0.24	1.7	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.	Paste	0.004	TDS
Electro-Bond 24	2	$18.99	Room Temp / Heat Cure	100/5	180 Minutes	1 Year	Silver	Silver	N/A	For electronics applications, for the assembly line manufacturing, for high RF shieldings.	N/A	3500	24 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	N/A	N/A	N/A	N/A	92	84	190	1270	from –50 to +190°C	N/A	N/A	N/A	Less than 2 Microns	N/A	N/A	N/A	100	0.003	2.63	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	1270	1.5	10.4	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.	Paste	2.00 E-03	TDS
Electro-Bond 07	2	$1.99	Room Temp / Heat Cure	100/100	45 Minutes	1 Year	Silver	Silver	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry.	N/A	13500	24 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	4.1	460	N/A	N/A	50	85	170	1250	From –50 To +170°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.0029	2.62	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	9500	1.56	11.2	1.5	EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical	Paste	1.00 E-03	TDS
Electro-Bond 06	2	$9.99	Room Temp / Heat Cure	100/5	60 Minutes	1 Year	Silver	Silver	N/A	For high strength application, electrical properties, perfect bond, cold solder for heat sensitive components.	N/A	13700	24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C	N/A	N/A	N/A	N/A	N/A	60	83	90	8500	from –50 to +130°C	N/A	N/A	N/A	40	N/A	N/A	N/A	100	0.004	2.59	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	8900	18.37	18.37	0.49	EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical	Paste	1.70 E-03	TDS
Electro-Bond G298	2	$159.99	Room Temp Or Heat Cure	100/4	30 Minutes	1 Year In Syringes And 3 Months In Pouches/bi-paks	Gold	Gold	N/A	This product is used in high-end aerospace and medical equipment to prevent cross-linking in high voltage / Amperage applications.	N/A	13000	15 minutes @ 120°C / 248 °F 90 minutes @ 80°C / 176 °F 10 hours @ 50°C / 122 °F 24 hours @ 25°C / 77 °F	N/A	N/A	@ 23°C: ≥ 5 Kg / 1,700 psi	N/A	N/A	≥ 100°C (Dynamic Cure 20—200°C /ISO 25 Min; Ramp- 10—200°C @ 20°C/Min	87	175	1000	from –50 to +130°C	0	N/A	N/A	50	N/A	N/A	N/A	N/A	0.003	N/A	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	N/A	N/A	N/A	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical	Paste	@ 23°C: ≤ 0.0009 Ohm-cm	TDS
Electro-Bond 01	1	$18.99	Heat Cure	N/A	6 Months	6 Months	Silver	Silver	N/A	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry,	N/A	12000	2 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °C	N/A	N/A	N/A	N/A	N/A	N/A	83	175	8700	from –50 to +170°C	N/A	N/A	N/A	40	N/A	N/A	N/A	N/A	N/A	2.79	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	8700	2.65	18.37	0.49	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry	Paste	1.70 E-04	TDS
Electro-Bond G2	1	$16.99	Heat Cure	N/A	6 Months	6 Months	Silver	Silver	N/A	Designed for high strength application, electrical properties with perfect bonding.	N/A	12000	2 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °C	N/A	N/A	N/A	N/A	N/A	N/A	83	175	8700	from –50 to +204°C	N/A	N/A	N/A	40	N/A	N/A	N/A	2.59	N/A	2.59	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	8700	2.65	18.37	0.49	EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry	Paste	1.70 E-04	TDS
Thermo-Bond 54	2	$9.99	Heat Cure / Room Temp Cure	100/6	3 Hours	1 Year	Grey	Alumina	N/A	Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.	N/A	6500	2 hrs @ 65°C +1hr @ 130 °C 2 hrs @ 65°C +2 hrs @100°C 48 hrs @ Room Temp	N/A	6	425	N/A	N/A	130	94	130	2000	from –50 to +160°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	10.1	2.43	metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials	3200	1	6.94	N/A	Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards	120000	5.00 E+15	TDS
Thermo-Bond 180	2	$9.99	Heat Cure	100/10	90 Minutes	1 Year	Black	Alumina	N/A	Very long pot life, heat curing for large casting and those applications requiring optimum properties with operating temperature up 425F.	N/A	15000	10 hours @ 175 °F 3 hours @ 225°F	N/A	4.4	485	0.015	N/A	N/A	90	175	8800	from –50 to +150°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.003	1.9	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	8800	1.44	10	14	Very long pot life heat curing for large casting and those applications requiring optimum properties with operating temperature up 425F	55000	1.5 E15	TDS
Thermo-Bond 56	2	$9.99	Room Temp	100/23	5 Minutes	1 Year	Grey	Alumina	N/A	Fast Cure, Strong Bond, durable High Impact Bonds at room temperature.	N/A	10000	60 minutes @ Room Temp	N/A	N/A	N/A	N/A	N/A	33 C	78	160	3400	from –50 to +110°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	N/A	2.25	metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials	3400	0.84	5.83	14.4	Fibers optic, potting and connectors	12,000	5.40 E+15	TDS
Thermo-Bond 90	2	$9.99	Room Temp	100/5	90 Minutes	1 Year	Black	Alumina	N/A	Shorter pot life, fast room temperature curative for casting Up to 1.5 inches thick and operating temperature Up to 300 F	N/A	15000	8 hours @ Room Temp 2 hours @ 60 °C	N/A	4.4	485	0.015	N/A	N/A	90	175	8800	from –50 to +150°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.003	1.9	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	8800	1.00	N/A	14	Shorter pot life fast room temperature curative for casting Up to 1.5 inches thick and operating temperature Up to 300 F	55000	1.50 E15	TDS
Thermo-Bond 110	2	$9.99	Room Temp	100/5	2 Hours	1 Year	Black	Alumina	N/A	Formulated to meet those applications which require electrical, physical and thermal properties with a service temperature Up to 205C	N/A	17000	24 hrs@ room temperature 10 min@ 175 °F 3 min@ 225°F	N/A	6.4	560	0.018	N/A	N/A	92	175	8500	from –50 to +205°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.001	2.3	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	8500	1.66	11.5	30	is designed to meet those applications which require electrical, physical and thermal properties with a service temperature Up to 205C	3000	4.90E+16	TDS
Thermo-Bond 53	2	$9.99	Room Temp / Heat Cure	100/7	45 Minutes	1 Year	Grey	Alumina	N/A	Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.	N/A	11000	24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C	N/A	6	N/A	410	N/A	110 C	87	175	8200	from –50 to +170°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	N/A	2.45	metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials	8200	1	6.92	14	Fibers optic, potting and connectors	Paste	5.40 E+15	TDS
Thermo-Bond 100	2	$9.99	Room Temp	100/15	90 Minutes	1 Year	Black	Alumina	N/A	Long pot life, low exothermic, room temprature curative for casting Up to 3 inches thick and operating temperature Up to 275F	N/A	15000	24 Hours @ Room Temp 3 hours @ 65 °C	N/A	4.4	485	0.015	N/A	N/A	90	175	8800	from –50 to +135°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.003	1.9	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	8800	1.44	btu	14	long pot life low exothermic room temperature curative for casting Up to 3 inches thick and operating temperature Up to 275F	55000	1.5 E5	TDS
Thermo-Bond 81	2	$9.99	Room Temp	100/10	90 Minutes	1 Year	Black	Alumina	N/A	Long pot life, low exothermic room temperature curative for casting Up to 6 inches thick and operating temperature Up to 250F.	N/A	15000	24 hours @ Room Temp 3 hours @ 65 °C	N/A	4.4	485	0.015	N/A	N/A	90	175	8800	from –50 to +125°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.003	1.9	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	8800	1.44	10	14	long pot life low exothermic room temperature curative for casting Up to 6 inches thick and operating temperature Up to 250F	55000	1.5 E15	TDS
Thermo-Bond 14	2	$9.99	Room Temp / Heat Cure	100/10	8 Hours	2 Year	Aluminum	Aluminum	N/A	Casting synthetic metals molds, dies and tools. very low shrinkage .	N/A	32000	24 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	N/A	N/A	N/A	N/A	125	85	125	1650	from –50 to +205°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.0006	2.11	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	15000	1.3	8.9	N/A	tooling, casting	120000	5.00E+10	TDS
Thermo-Bond 95	2	$9.99	Room Temp / Heat Cure	100/15	60 Minutes	1 Year	Off White	Boron Nitride	N/A	Intended for electronics applications, for the assembly line manufacturing, Heat Transfers components.	N/A	6500	24 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	N/A	N/A	N/A	N/A	54	80	175	1250	from –50 to +170°C	0.02	0.6	N/A	45	N/A	N/A	N/A	100	0.003	1.30	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	3400	0.46	3.2	N/A	Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards	Paste	3.4 E+15	TDS
Thermo-Bond 26	2	$9.99	Room Temp / Heat Cure	100/14	50 Minutes	1 Year	Grey	Alumina	N/A	Designed for electronics applications, for the assembly line manufacturing, Heat Transfers components.	N/A	9,500	25 hours @ Room Temp 2 to 4 hours @ 60°C	N/A	N/A	410	N/A	N/A	113	82	170	1750	from –50 to +135°C	N/A	N/A	N/A	45	N/A	N/A	N/A	100	0.0012	2.35	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	1750	0.46	3.2	N/A	Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards	Paste	3.4 E+15	TDS
Thermo-Bond 12	2	$9.99	Room Temp	100/4	30 Minutes	1 Year	Black	Alumina	N/A	Designed for applications requiring room temperature curing, will remain rigid Up to service temperature of 150C.	N/A	17000	24 hours @ Room Temp 3 hours @ 65 °C	N/A	6.4	560	0.018	N/A	N/A	92	175	8500	from –50 to +150°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.001	2.3	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	8500	1.66	11.5	30	is designed for applications requiring room temperature curing, will remain rigid Up to service temperature of 150C	90000	4.90E+16	TDS
Thermo-Bond 24	2	$9.99	Room Temp	100/7	30 Minutes	1 Year	Black	Alumina	N/A	Designed for applications requiring room temperature curing, lowest viscosity and best handling properties with a service temperature Up to 150C. Will soften slightly above 121C.	N/A	17000	24 hours @ Room Temp 3 hours @ 65 °C	N/A	6.4	560	0.018	N/A	N/A	92	175	8500	from –50 to +150°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.001	2.3	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board	8500	1.66	11.5	30	is designed for applications requiring room temperature curing, lowest viscosity and best handling properties with a service temperature Up to 150C. Will soften slightly above 121C	15000	4.90 E16	TDS
Thermo-Grease 04	N/A	$9.99	N/A	N/A	N/A	2 Years	Off White	Zinc Oxide	Silicone	N/A	0	N/A	cure_schedule	N/A	4.4	390	N/A	0	N/A	N/A	N/A	N/A	-40 to 190°C	N/A	N/A	N/A	N/A	N/A	Thermal coupler for any heat sink device temperature sensors, power transistors, thermal joints, for any device where efficient cooling is required.	15	N/A	N/A	2.46	N/A	N/A	0.9	N/A	N/A	N/A	Paste	2.9 E+14	TDS
Thermo-Bond 51	2	$12.99	Room Temp / Heat Cure	100/9	40 Minutes	1 Year	Grey	Alumina	N/A	Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.	N/A	10000	24 hours @ Room Temp 3 hours @ 65°C	N/A	N/A	N/A	N/A	N/A	60	89	115	7500	from –50 to +125°C	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.003	2.3	Metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials	7500	0.92	6.52	14.4	Fibers optic, potting and connectors	40,000	2.10 E+15	TDS
ConductiveX Repair Kit	2	$1.99	Room Temperature	100/5	6 Minutes	6 Months	Silver	Silver	N/A	Designed For fast cure rear Window Defroster, Grid Repair and Tab adhesives.	N/A	13400	4 hours @ Room Temp 10 minutes @ 60 °C	N/A	N/A	N/A	N/A	N/A	60	83	95	9400	From -20 to +200°F	N/A	N/A	N/A	44	N/A	N/A	N/A	100	0.003	2.64	Glass, aluminum, Steel Bronze and ceramic	2200	1.46	10	N/A	Back Glass Defroster power tab antenna repair and electrically conductive components repair.	Paste	1.00 E-03	TDS

Gold

Silver

Nickel

Graphite

Carbon

By Application

By Properties

By Viscosity

Alumina

Aluminum

Boron Nitride

Ceramic

Copper

FDA Grade

Alumina

Boron Nitride

Food Grade Grease

Non-Silicone Grease

Zinc Oxide

Technical Datasheets