Technical Datasheets
Product | Components | Base Price | Cure Type | Mix Ratio | Working Life | Shelf Life | Appearance | Filler | Base Fluid | Benefits | Bleeding | Compressive Strength | Cure Schedule | Density | Dielectric Constant | Dielectric Strength | Dissipation Factor | Evaporation | Glass Transition Temp | Hardness | Heat Distortion | Lap Shear Strength | Operating Temp | Outgassing, CVCM | Outgassing, TML | Outgassing, WVR | Particle Size | Penetration | Potential Uses | Press Flow | Reactive Solids | Shrinkage Linear | Specific Gravity | Substrates | Tensile Strength | Thermal Conductivity, WMK | Thermal Conductivity, BTU | Thermal Expansion Coefficient | Typical Applications | Viscosity | Volume Resistivity | TDS |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Electro-Bond 61 | 2 | $9.99 | Room Temp / Heat Cure | 100/10 | 30 Minutes | 1 Year | Black | Carbon | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry
Read More
|
N/A | 12000 | 24 hours @ Room Temp 2 to4 hours @ 60°C | N/A | N/A | N/A | N/A | N/A | 30°C | 80 | 100 | 1850 | from –50 to +100°C | N/A | N/A | N/A | 25 | N/A |
N/A
|
N/A | 100 | 0.003 | 1.18 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
3500 | 0.25 | 1.8 | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.
Read More
|
Paste | < 40 | TDS |
COA | N/A | $35.00 | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
N/A
|
N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
N/A
|
N/A | N/A | N/A | N/A |
N/A
|
N/A | N/A | N/A | N/A |
N/A
|
N/A | N/A | TDS |
CoC | N/A | $24.99 | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
N/A
|
N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
N/A
|
N/A | N/A | N/A | N/A |
N/A
|
N/A | N/A | N/A | N/A |
N/A
|
N/A | N/A | TDS |
Electro-Bond 13 | 2 | $9.99 | Room Temp / Heat Cure | 1:1 | 30 Minutes | 1 Year | Grey | Silver/Copper | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry
Read More
|
N/A | 3500 | 24 hours @ Room Temp 2 to 4 hours @ 60°C | N/A | 4.2 | 410 | 0.015 | N/A | 60°C | 80 | 150 | 940 PSI | from –50 to +170°C | N/A | N/A | N/A | 45 | N/A |
N/A
|
N/A | 100 | 0.003 | 2.32 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
1650 | 1.15 | 8 | 30 |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.
Read More
|
Paste | 3.70 E-2 | TDS |
Electro-Bond 004 | 1 | $19.99 | Heat Cure | N/A | 6 Months | 6 Months | Silver | Silver | N/A |
Microwave Applications for EMI and RFI shielding, ...
Microwave Applications for EMI and RFI shielding, for assembly and repair of circuit boards and electronic components manufacturing .
Read More
|
N/A | 12000 | 2 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °C | N/A | N/A | N/A | N/A | N/A | N/A | 87 | 175 | 8500 | from –50 to +204°C | 0.01 | 0.38 | 0.07 | 17 | N/A |
N/A
|
N/A | 100 | N/A | 2.69 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
8500 | 2.99 | 20.74 | 0.49 |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry
Read More
|
Paste | 1.00 E-03 | TDS |
Electro-Bond 02 | 2 | $18.99 | Room Temp / Heat Cure | 100/5 | 60 Minutes | 1 Year | Silver | Silver | N/A |
Formulated for high strength application, electric...
Formulated for high strength application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.
Read More
|
N/A | 13000 | 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C | N/A | N/A | N/A | N/A | N/A | 60°C | 85 | 175 | 1400 | from –50 to +130°C | N/A | 0.62 | 0.13 | 17 | N/A |
N/A
|
N/A | 100 | 0.003 | 2.79 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
880 | 2.99 | 20.73 | 0.49 |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.
Read More
|
Paste | 6.00 E-04 | TDS |
Electro-Bond 02LP | 2 | $18.99 | Room Temp / Heat Cure | 100/6 | 180 Minutes | 1 Year | Silver | Silver | N/A |
Designed for high strength application, electrical...
Designed for high strength application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.
Read More
|
N/A | 13000 | 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C | N/A | N/A | N/A | N/A | N/A | 60°C | 87 | 175 | 1000 | from –50 to +130°C | N/A | 0.61 | 0.13 | 17 | N/A |
N/A
|
N/A | 100 | 0.003 | 2.79 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
9400 | 2.99 | 20.73 | 0.49 |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical
Read More
|
Paste | 6.00 E-04 | TDS |
Electro-Bond 03 | 2 | $9.99 | Room Temp / Heat Cure | 100/5 | 60 Minutes | 1 Year | Grey | Nickel | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.
Read More
|
N/A | 13500 | 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C | N/A | N/A | N/A | N/A | N/A | 60°C | 85 | 130 | 1100 | from –50 to +170°C | N/A | N/A | N/A | 40 | N/A |
N/A
|
N/A | 100 | 0.003 | 2.69 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
8900 | 1.44 | 10 | 0.45 |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.
Read More
|
Paste | <0.038 | TDS |
Electro-Bond 79 | 1 | $18.99 | Heat Cure Only | N/A | 3 Months | 3 Months | Silver | Silver | N/A |
Designed for electronics applications, for the assembly line manufacturing, for high RF shieldings.
|
N/A | 3600 | 2 hours @ 125°C | 1 hour @ 150°C | 1/2 hours @ 175°C | N/A | N/A | N/A | N/A | N/A | 45°C | 85 | 150 | 1720 | from –50 to +150°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | N/A | 2.62 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
1720 | 1.45 | 10.3 | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.
Read More
|
Paste | 3.00 E -3 | TDS |
Electro-Bond 20 | 1 | $18.99 | Heat Cure | N/A | 6 Months | 6 Months | Silver | Silver | N/A |
Intended for electronics applications, for the assembly line manufacturing, for high RF shieldings.
|
N/A | 9,000 | 1 hour @ 120 °C 15 min @ 150 °C 4 min @ 175 °C | N/A | N/A | N/A | N/A | N/A | 42°C | 80 | 170 | 900 | from –50 to +170°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | N/A | 2.61 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
3,500 | 1.43 | 10.2 | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.
Read More
|
Paste | 3.00 E-4 | TDS |
Electro-Bond 80 | 1 | $18.99 | Heat Cure | N/A | 6 Months | 6 Months | Silver | Silver | N/A |
Formulated for electronics applications, for the a...
Formulated for electronics applications, for the assembly line manufacturing, for high RF shieldings.
Read More
|
N/A | 8,500 | 1 hour @ 125°C / 15 minutes@ 150°C / 4 minutes @ 175°C | N/A | N/A | N/A | N/A | N/A | 40°C | 78 | 175 | 840 | from –50 to +190°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | N/A | 2.33 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
3700 | 1.39 | 10.1 | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.
Read More
|
Paste | <0.0005 | TDS |
Thermo-Grease FDA 7 | 1 | $9.99 | Grease | N/A | N/A | 2 Years | Off White | Zinc Oxide | FDA Silicone |
N/A
|
N/A | N/A | -40 to 190 | N/A | 4.4 | 390 | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
Thermal coupler for any heat sink device tempera...
Thermal coupler for any heat sink device temperature sensors, power transistors, thermal joints, for any device where efficient cooling is required.
Read More
|
15 | N/A | N/A | 2.5 |
N/A
|
N/A | 0.9 | N/A | N/A |
Thermal coupler for any heat sink device tempera...
Thermal coupler for any heat sink device temperature sensors, power transistors, thermal joints, for any device where efficient cooling is required.
Read More
|
Paste | 2.9 E+14 | TDS |
Electro-Bond 14 | 2 | $9.99 | Room Temp / Heat Cure | 100/15 | 45 Minutes | 1 Year | Grey | Silver/Copper | N/A |
Designed for flexible circuits application, electr...
Designed for flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive semiconductor components. It is also a great option for die attach applications.
Read More
|
N/A | 3000 | 24 hours @ Room Temp 2 to 4 hours @ 60°C | N/A | 4.1 | 410 | 0.015 | N/A | 60°C | 60 | 149 | 9400 | from –50 to +170°C | N/A | N/A | N/A | 45 | N/A |
N/A
|
N/A | 100 | 0.003 | 2.32 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
1240 | 1.16 | 8.1 | 30 |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.
Read More
|
Paste | 3.60 E+5 | TDS |
Electro-Bond 19 | 2 | $18.99 | Room Temp / Heat Cure | 90/100 | 30 Minutes | 1 Year | Silver | Silver | N/A |
For flexible circuits application, electrical and...
For flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.
Read More
|
N/A | 3200 | 24 hours @ Room Temp 2 to 4 hours @ 60°C | N/A | N/A | N/A | N/A | N/A | 30°C | 78 | 110 | N/A | from –50 to +170°C | N/A | N/A | N/A | 25 | N/A |
N/A
|
N/A | 100 | 0.003 | 2.32 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
2400 | 1.5 | 10.6 | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.
Read More
|
Paste | 1.00 E03 | TDS |
Electro-Bond 16 | 2 | $18.99 | Room Temp / Heat Cure | 100/115 | 90 Minutes | 1 Year | Silver | Silver | N/A |
Designed for flexible circuits application, elect...
Designed for flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.
Read More
|
N/A | 4500 | 24 hours @ Room Temp 2 to 4 hours @ 60°C | N/A | N/A | N/A | N/A | N/A | 30 | 64 | 110 | N/A | from –50 to +170°C | N/A | N/A | N/A | 17 | N/A |
N/A
|
N/A | 100 | 0.003 | 2.85 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
3500 | 1.49 | 10.3 | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical
Read More
|
Paste | 1.00 E03 | TDS |
Electro-Bond 17 | 2 | $1.99 | Room Temp / Heat Cure | 100/100 | 60 Minutes | 1 Year | Silver | Silver | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry.
Read More
|
N/A | 6500 | 24 hours @ Room Temp 2 to 4 hours @ 60°C | N/A | 4 | 410 | N/A | N/A | 35 | 63 | 170 | 850 | from –50 to +140°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | 0.0016 | 2.46 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
1240 | 1.52 | 11 | 1.4 |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.
Read More
|
Paste | 1.00 E-03 | TDS |
Electro-Bond F3 | 2 | $9.99 | Room Temp / Heat Cure | 100/15 | 90 Minutes | 1 Year | Nickel | Nickel | N/A |
Designed for flexible circuits application, elect...
Designed for flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.
Read More
|
N/A | 3200 | 24 hours @ Room Temp 2 to 4 hours @ 60°C | N/A | N/A | N/A | N/A | N/A | 60 | 65 | 125 | 1300 | from –50 to +150°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | 0.003 | 2.79 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
1250 | 1.44 | 10 | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.
Read More
|
Paste | <0.004 | TDS |
Thermo-Bond 58 | 2 | $9.99 | Room Temp / Heat Cure | 100/38 | 2 Hours | 1 Year | Grey | Alumina | N/A |
Staking transistors, diodes, resistors, integrated...
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.
Read More
|
N/A | 8500 | 24 hours @ Room Temp 2 to 4 hours @ 60°C | N/A | 6 | 410 | N/A | N/A | N/A | 60 | 125 | 1850 | from –50 to +125°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | N/A | 2.3 |
metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
|
3500 | 0.82 | N/A | N/A |
Staking transistors, diodes, resistors, integrated...
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards
Read More
|
Paste | 2.0 E+15 | TDS |
Electro-Bond 63 | 1 | $9.99 | Heat Cure | N/A | 6 Months | 6 Months | Grey | Graphite | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry
Read More
|
N/A | 11000 | 1 hour @ 120 C | N/A | N/A | N/A | N/A | N/A | N/A | 80 | 170 | 2600 | from –50 to +170°C | N/A | N/A | N/A | 42 Micron | N/A |
N/A
|
N/A | 100 | 0.003 | 1.28 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
3600 | 0.25 | 1.7 | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.
Read More
|
Paste | 43 | TDS |
Electro-Bond 62 | 2 | $9.99 | Room Temp / Heat Cure | 100/10 | 40 Minutes | 1 Year | Grey | Graphite | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry,
Read More
|
N/A | 11000 | 24 hours @ Room Temp 2 to 4 hours @ 60°C | N/A | N/A | N/A | N/A | N/A | 30 | 78 | 100 | 2300 | from –50 to +110°C | N/A | N/A | N/A | 42 Micron | N/A |
N/A
|
N/A | 100 | 0.003 | 1.29 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
3400 | 0.24 | 1.7 | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.
Read More
|
Paste | 0.004 | TDS |
Electro-Bond 24 | 2 | $18.99 | Room Temp / Heat Cure | 100/5 | 180 Minutes | 1 Year | Silver | Silver | N/A |
For electronics applications, for the assembly line manufacturing, for high RF shieldings.
|
N/A | 3500 | 24 hours @ Room Temp 2 to 4 hours @ 60°C | N/A | N/A | N/A | N/A | N/A | 92 | 84 | 190 | 1270 | from –50 to +190°C | N/A | N/A | N/A | Less than 2 Microns | N/A |
N/A
|
N/A | 100 | 0.003 | 2.63 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
1270 | 1.5 | 10.4 | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.
Read More
|
Paste | 2.00 E-03 | TDS |
Electro-Bond 07 | 2 | $1.99 | Room Temp / Heat Cure | 100/100 | 45 Minutes | 1 Year | Silver | Silver | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry.
Read More
|
N/A | 13500 | 24 hours @ Room Temp 2 to 4 hours @ 60°C | N/A | 4.1 | 460 | N/A | N/A | 50 | 85 | 170 | 1250 | From –50 To +170°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | 0.0029 | 2.62 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
9500 | 1.56 | 11.2 | 1.5 |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical
Read More
|
Paste | 1.00 E-03 | TDS |
Electro-Bond 06 | 2 | $9.99 | Room Temp / Heat Cure | 100/5 | 60 Minutes | 1 Year | Silver | Silver | N/A |
For high strength application, electrical properti...
For high strength application, electrical properties, perfect bond, cold solder for heat sensitive components.
Read More
|
N/A | 13700 | 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C | N/A | N/A | N/A | N/A | N/A | 60 | 83 | 90 | 8500 | from –50 to +130°C | N/A | N/A | N/A | 40 | N/A |
N/A
|
N/A | 100 | 0.004 | 2.59 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
8900 | 18.37 | 18.37 | 0.49 |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical
Read More
|
Paste | 1.70 E-03 | TDS |
Electro-Bond G298 | 2 | $399.99 | Room Temp Or Heat Cure | 100/4 | 30 Minutes | 1 Year In Syringes And 3 Months In Pouches/bi-paks | Gold | Gold | N/A |
This product is used in high-end aerospace and med...
This product is used in high-end aerospace and medical equipment to prevent cross-linking in high voltage / Amperage applications.
Read More
|
N/A | 13000 | 15 minutes @ 120°C / 248 °F 90 minutes @ 80°C / 176 °F 10 hours @ 50°C / 122 °F 24 hours @ 25°C / 77 °F | N/A | N/A | @ 23°C: ≥ 5 Kg / 1,700 psi | N/A | N/A | ≥ 100°C (Dynamic Cure 20—200°C /ISO 25 Min; Ramp- 10—200°C @ 20°C/Min | 87 | 175 | 1000 | from –50 to +130°C | N/A | N/A | N/A | 50 | N/A |
N/A
|
N/A | N/A | 0.003 | N/A |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
N/A | N/A | N/A | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical
Read More
|
Paste | @ 23°C: ≤ 0.0009 Ohm-cm | TDS |
Electro-Bond 01 | 1 | $18.99 | Heat Cure | N/A | 6 Months | 6 Months | Silver | Silver | N/A |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry,
Read More
|
N/A | 12000 | 2 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °C | N/A | N/A | N/A | N/A | N/A | N/A | 83 | 175 | 8700 | from –50 to +170°C | N/A | N/A | N/A | 40 | N/A |
N/A
|
N/A | N/A | N/A | 2.79 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
8700 | 2.65 | 18.37 | 0.49 |
EMI & RFI shielding, in the assembly or repair...
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry
Read More
|
Paste | 1.70 E-04 | TDS |
test | N/A | $0.25 | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
N/A
|
N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
N/A
|
N/A | N/A | N/A | N/A |
N/A
|
N/A | N/A | N/A | N/A |
N/A
|
N/A | N/A | TDS |
Thermo-Bond 54 | 2 | $9.99 | Heat Cure / Room Temp Cure | 100/6 | 3 Hours | 1 Year | Grey | Alumina | N/A |
Staking transistors, diodes, resistors, integrated...
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.
Read More
|
N/A | 6500 | 2 hrs @ 65°C +1hr @ 130 °C 2 hrs @ 65°C +2 hrs @100°C 48 hrs @ Room Temp | N/A | 6 | 425 | N/A | N/A | 130 | 94 | 130 | 2000 | from –50 to +160°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | 10.1 | 2.43 |
metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
|
3200 | 1 | 6.94 | N/A |
Staking transistors, diodes, resistors, integrated...
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards
Read More
|
120000 | 5.00 E+15 | TDS |
Thermo-Bond 180 | 2 | $9.99 | Heat Cure | 100/10 | 90 Minutes | 1 Year | Black | Alumina | N/A |
Very long pot life, heat curing for large casting ...
Very long pot life, heat curing for large casting and those applications requiring optimum properties with operating temperature up 425F.
Read More
|
N/A | 15000 | 10 hours @ 175 °F 3 hours @ 225°F | N/A | 4.4 | 485 | 0.015 | N/A | N/A | 90 | 175 | 8800 | from –50 to +150°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | 0.003 | 1.9 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
8800 | 1.44 | 10 | 14 |
Very long pot life heat curing for large casting a...
Very long pot life heat curing for large casting and those applications requiring optimum properties with operating temperature up 425F
Read More
|
55000 | 1.5 E15 | TDS |
Thermo-Bond 56 | 2 | $9.99 | Room Temp | 100/23 | 5 Minutes | 1 Year | Grey | Alumina | N/A |
Fast Cure, Strong Bond, durable High Impact Bonds at room temperature.
|
N/A | 10000 | 60 minutes @ Room Temp | N/A | N/A | N/A | N/A | N/A | 33 C | 78 | 160 | 3400 | from –50 to +110°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | N/A | 2.25 |
metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
|
3400 | 0.84 | 5.83 | 14.4 |
Fibers optic, potting and connectors
|
12,000 | 5.40 E+15 | TDS |
Thermo-Bond 90 | 2 | $9.99 | Room Temp | 100/5 | 90 Minutes | 1 Year | Black | Alumina | N/A |
Shorter pot life, fast room temperature curative f...
Shorter pot life, fast room temperature curative for casting Up to 1.5 inches thick and operating temperature Up to 300 F
Read More
|
N/A | 15000 | 8 hours @ Room Temp 2 hours @ 60 °C | N/A | 4.4 | 485 | 0.015 | N/A | N/A | 90 | 175 | 8800 | from –50 to +150°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | 0.003 | 1.9 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
8800 | 1.00 | N/A | 14 |
Shorter pot life fast room temperature curative fo...
Shorter pot life fast room temperature curative for casting Up to 1.5 inches thick and operating temperature Up to 300 F
Read More
|
55000 | 1.50 E15 | TDS |
Thermo-Bond 110 | 2 | $9.99 | Room Temp | 100/5 | 2 Hours | 1 Year | Black | Alumina | N/A |
Formulated to meet those applications which requir...
Formulated to meet those applications which require electrical, physical and thermal properties with a service temperature Up to 205C
Read More
|
N/A | 17000 | 24 hrs@ room temperature 10 min@ 175 °F 3 min@ 225°F | N/A | 6.4 | 560 | 0.018 | N/A | N/A | 92 | 175 | 8500 | from –50 to +205°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | 0.001 | 2.3 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
8500 | 1.66 | 11.5 | 30 |
is designed to meet those applications which requi...
is designed to meet those applications which require electrical, physical and thermal properties with a service temperature Up to 205C
Read More
|
3000 | 4.90E+16 | TDS |
Thermo-Bond 53 | 2 | $9.99 | Room Temp / Heat Cure | 100/7 | 45 Minutes | 1 Year | Grey | Alumina | N/A |
Staking transistors, diodes, resistors, integrated...
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.
Read More
|
N/A | 11000 | 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C | N/A | 6 | N/A | 410 | N/A | 110 C | 87 | 175 | 8200 | from –50 to +170°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | N/A | 2.45 |
metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
|
8200 | 1 | 6.92 | 14 |
Fibers optic, potting and connectors
|
Paste | 5.40 E+15 | TDS |
Thermo-Bond 95 | 2 | $17.99 | Room Temp / Heat Cure | 100/15 | 60 Minutes | 1 Year | Off White | Boron Nitride | N/A |
Intended for electronics applications, for the ass...
Intended for electronics applications, for the assembly line manufacturing, Heat Transfers components.
Read More
|
N/A | 6500 | 24 hours @ Room Temp 2 to 4 hours @ 60°C | N/A | N/A | N/A | N/A | N/A | 54 | 80 | 175 | 1250 | from –50 to +170°C | 0.02 | 0.6 | N/A | 45 | N/A |
N/A
|
N/A | 100 | 0.003 | 1.30 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
3400 | 0.46 | 3.2 | N/A |
Staking transistors, diodes, resistors, integrated...
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards
Read More
|
Paste | 3.4 E+15 | TDS |
Thermo-Bond 26 | 2 | $9.99 | Room Temp / Heat Cure | 100/14 | 50 Minutes | 1 Year | Grey | Alumina | N/A |
Designed for electronics applications, for the ass...
Designed for electronics applications, for the assembly line manufacturing, Heat Transfers components.
Read More
|
N/A | 9,500 | 25 hours @ Room Temp 2 to 4 hours @ 60°C | N/A | N/A | 410 | N/A | N/A | 113 | 82 | 170 | 1750 | from –50 to +135°C | N/A | N/A | N/A | 45 | N/A |
N/A
|
N/A | 100 | 0.0012 | 2.35 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
1750 | 0.46 | 3.2 | N/A |
Staking transistors, diodes, resistors, integrated...
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards
Read More
|
Paste | 3.4 E+15 | TDS |
Thermo-Bond 24 | 2 | $9.99 | Room Temp | 100/7 | 30 Minutes | 1 Year | Black | Alumina | N/A |
Designed for applications requiring room temperatu...
Designed for applications requiring room temperature curing, lowest viscosity and best handling properties with a service temperature Up to 150C. Will soften slightly above 121C.
Read More
|
N/A | 17000 | 24 hours @ Room Temp 3 hours @ 65 °C | N/A | 6.4 | 560 | 0.018 | N/A | N/A | 92 | 175 | 8500 | from –50 to +150°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | 0.001 | 2.3 |
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
|
8500 | 1.66 | 11.5 | 30 |
is designed for applications requiring room temper...
is designed for applications requiring room temperature curing, lowest viscosity and best handling properties with a service temperature Up to 150C. Will soften slightly above 121C
Read More
|
15000 | 4.90 E16 | TDS |
Thermo-Grease 04 | N/A | $9.99 | N/A | N/A | N/A | 2 Years | Off White | Zinc Oxide | Silicone |
N/A
|
N/A | N/A | cure_schedule | N/A | 4.4 | 390 | N/A | N/A | N/A | N/A | N/A | N/A | -40 to 190°C | N/A | N/A | N/A | N/A | N/A |
Thermal coupler for any heat sink device temperatu...
Thermal coupler for any heat sink device temperature sensors, power transistors, thermal joints, for any device where efficient cooling is required.
Read More
|
15 | N/A | N/A | 2.46 |
N/A
|
N/A | 0.9 | N/A | N/A |
N/A
|
Paste | 2.9 E+14 | TDS |
Thermo-Bond 51 | 2 | $12.99 | Room Temp / Heat Cure | 100/9 | 40 Minutes | 1 Year | Grey | Alumina | N/A |
Staking transistors, diodes, resistors, integrated...
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.
Read More
|
N/A | 10000 | 24 hours @ Room Temp 3 hours @ 65°C | N/A | N/A | N/A | N/A | N/A | 60 | 89 | 115 | 7500 | from –50 to +125°C | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | 0.003 | 2.3 |
Metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
|
7500 | 0.92 | 6.52 | 14.4 |
Fibers optic, potting and connectors
|
40,000 | 2.10 E+15 | TDS |
ConductiveX Repair Kit | 2 | $1.99 | Room Temperature | 100/5 | 6 Minutes | 6 Months | Silver | Silver | N/A |
Designed For fast cure rear Window Defroster, Grid Repair and Tab adhesives.
|
N/A | 13400 | 4 hours @ Room Temp 10 minutes @ 60 °C | N/A | N/A | N/A | N/A | N/A | 60 | 83 | 95 | 9400 | From -20 to +200°F | N/A | N/A | N/A | 44 | N/A |
N/A
|
N/A | 100 | 0.003 | 2.64 |
Glass, aluminum, Steel Bronze and ceramic
|
2200 | 1.46 | 10 | N/A |
Back Glass Defroster power tab antenna repair and electrically conductive components repair.
|
Paste | 1.00 E-03 | TDS |