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Technical Datasheets

Product Components Base Price Cure Type Mix Ratio Working Life Shelf Life Appearance Filler Base Fluid Benefits Bleeding Compressive Strength Cure Schedule Density Dielectric Constant Dielectric Strength Dissipation Factor Evaporation Glass Transition Temp Hardness Heat Distortion Lap Shear Strength Operating Temp Outgassing, CVCM Outgassing, TML Outgassing, WVR Particle Size Penetration Potential Uses Press Flow Reactive Solids Shrinkage Linear Specific Gravity Substrates Tensile Strength Thermal Conductivity, WMK Thermal Conductivity, BTU Thermal Expansion Coefficient Typical Applications Viscosity Volume Resistivity TDS
Electro-Bond 61 2 $9.99 Room Temp / Heat Cure 100/10 30 Minutes 1 Year Black Carbon N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry Read More
N/A 12000 24 hours @ Room Temp 2 to4 hours @ 60°C N/A N/A N/A N/A N/A 30°C 80 100 1850 from –50 to +100°C N/A N/A N/A 25 N/A
N/A
N/A 100 0.003 1.18
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
3500 0.25 1.8 N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. Read More
Paste < 40 TDS
COA N/A $35.00 N/A N/A N/A N/A N/A N/A N/A
N/A
N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A
N/A
N/A N/A N/A N/A
N/A
N/A N/A N/A N/A
N/A
N/A N/A TDS
CoC N/A $24.99 N/A N/A N/A N/A N/A N/A N/A
N/A
N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A
N/A
N/A N/A N/A N/A
N/A
N/A N/A N/A N/A
N/A
N/A N/A TDS
Electro-Bond 13 2 $9.99 Room Temp / Heat Cure 1:1 30 Minutes 1 Year Grey Silver/Copper N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry Read More
N/A 3500 24 hours @ Room Temp 2 to 4 hours @ 60°C N/A 4.2 410 0.015 N/A 60°C 80 150 940 PSI from –50 to +170°C N/A N/A N/A 45 N/A
N/A
N/A 100 0.003 2.32
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
1650 1.15 8 30
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. Read More
Paste 3.70 E-2 TDS
Electro-Bond 004 1 $19.99 Heat Cure N/A 6 Months 6 Months Silver Silver N/A
Microwave Applications for EMI and RFI shielding, ... Microwave Applications for EMI and RFI shielding, for assembly and repair of circuit boards and electronic components manufacturing . Read More
N/A 12000 2 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °C N/A N/A N/A N/A N/A N/A 87 175 8500 from –50 to +204°C 0.01 0.38 0.07 17 N/A
N/A
N/A 100 N/A 2.69
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
8500 2.99 20.74 0.49
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry Read More
Paste 1.00 E-03 TDS
Electro-Bond 02 2 $19.99 Room Temp / Heat Cure 100/5 60 Minutes 1 Year Silver Silver N/A
Formulated for high strength application, electric... Formulated for high strength application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components. Read More
N/A 13000 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C N/A N/A N/A N/A N/A 60°C 85 175 1400 from –50 to +130°C N/A 0.62 0.13 17 N/A
N/A
N/A 100 0.003 2.79
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
880 2.99 20.73 0.49
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical. Read More
Paste 6.00 E-04 TDS
Electro-Bond 02LP 2 $19.99 Room Temp / Heat Cure 100/6 180 Minutes 1 Year Silver Silver N/A
Designed for high strength application, electrical... Designed for high strength application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components. Read More
N/A 13000 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C N/A N/A N/A N/A N/A 60°C 87 175 1000 from –50 to +130°C N/A 0.61 0.13 17 N/A
N/A
N/A 100 0.003 2.79
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
9400 2.99 20.73 0.49
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical Read More
Paste 6.00 E-04 TDS
Electro-Bond 03 2 $9.99 Room Temp / Heat Cure 100/5 60 Minutes 1 Year Grey Nickel N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical. Read More
N/A 13500 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C N/A N/A N/A N/A N/A 60°C 85 130 1100 from –50 to +170°C N/A N/A N/A 40 N/A
N/A
N/A 100 0.003 2.69
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
8900 1.44 10 0.45
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical. Read More
Paste <0.038 TDS
Electro-Bond 79 1 $19.99 Heat Cure Only N/A 3 Months 3 Months Silver Silver N/A
Designed for electronics applications, for the assembly line manufacturing, for high RF shieldings.
N/A 3600 2 hours @ 125°C | 1 hour @ 150°C | 1/2 hours @ 175°C N/A N/A N/A N/A N/A 45°C 85 150 1720 from –50 to +150°C N/A N/A N/A 44 N/A
N/A
N/A 100 N/A 2.62
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
1720 1.45 10.3 N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. Read More
Paste 3.00 E -3 TDS
Electro-Bond 20 1 $19.99 Heat Cure N/A 6 Months 6 Months Silver Silver N/A
Intended for electronics applications, for the assembly line manufacturing, for high RF shieldings.
N/A 9,000 1 hour @ 120 °C 15 min @ 150 °C 4 min @ 175 °C N/A N/A N/A N/A N/A 42°C 80 170 900 from –50 to +170°C N/A N/A N/A 44 N/A
N/A
N/A 100 N/A 2.61
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
3,500 1.43 10.2 N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. Read More
Paste 3.00 E-4 TDS
Electro-Bond 80 1 $19.99 Heat Cure N/A 6 Months 6 Months Silver Silver N/A
Formulated for electronics applications, for the a... Formulated for electronics applications, for the assembly line manufacturing, for high RF shieldings. Read More
N/A 8,500 1 hour @ 125°C / 15 minutes@ 150°C / 4 minutes @ 175°C N/A N/A N/A N/A N/A 40°C 78 175 840 from –50 to +190°C N/A N/A N/A 44 N/A
N/A
N/A 100 N/A 2.33
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
3700 1.39 10.1 N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. Read More
Paste <0.0005 TDS
Thermo-Grease FDA 7 1 $9.99 Grease N/A N/A 2 Years Off White Zinc Oxide FDA Silicone
N/A
N/A N/A -40 to 190 N/A 4.4 390 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A
Thermal coupler for any heat sink device tempera... Thermal coupler for any heat sink device temperature sensors, power transistors, thermal joints, for any device where efficient cooling is required. Read More
15 N/A N/A 2.5
N/A
N/A 0.9 N/A N/A
Thermal coupler for any heat sink device tempera... Thermal coupler for any heat sink device temperature sensors, power transistors, thermal joints, for any device where efficient cooling is required. Read More
Paste 2.9 E+14 TDS
Electro-Bond 14 2 $9.99 Room Temp / Heat Cure 100/15 45 Minutes 1 Year Grey Silver/Copper N/A
Designed for flexible circuits application, electr... Designed for flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive semiconductor components. It is also a great option for die attach applications. Read More
N/A 3000 24 hours @ Room Temp 2 to 4 hours @ 60°C N/A 4.1 410 0.015 N/A 60°C 60 149 9400 from –50 to +170°C N/A N/A N/A 45 N/A
N/A
N/A 100 0.003 2.32
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
1240 1.16 8.1 30
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. Read More
Paste 3.60 E+5 TDS
Electro-Bond 19 2 $18.99 Room Temp / Heat Cure 90/100 30 Minutes 1 Year Silver Silver N/A
For flexible circuits application, electrical and... For flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components. Read More
N/A 3200 24 hours @ Room Temp 2 to 4 hours @ 60°C N/A N/A N/A N/A N/A 30°C 78 110 N/A from –50 to +170°C N/A N/A N/A 25 N/A
N/A
N/A 100 0.003 2.32
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
2400 1.5 10.6 N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical. Read More
Paste 1.00 E03 TDS
Electro-Bond 16 2 $19.99 Room Temp / Heat Cure 100/115 90 Minutes 1 Year Silver Silver N/A
Designed for flexible circuits application, elect... Designed for flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components. Read More
N/A 4500 24 hours @ Room Temp 2 to 4 hours @ 60°C N/A N/A N/A N/A N/A 30 64 110 N/A from –50 to +170°C N/A N/A N/A 17 N/A
N/A
N/A 100 0.003 2.85
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
3500 1.49 10.3 N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical Read More
Paste 1.00 E03 TDS
Electro-Bond 17 2 $1.99 Room Temp / Heat Cure 100/100 60 Minutes 1 Year Silver Silver N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry. Read More
N/A 6500 24 hours @ Room Temp 2 to 4 hours @ 60°C N/A 4 410 N/A N/A 35 63 170 850 from –50 to +140°C N/A N/A N/A 44 N/A
N/A
N/A 100 0.0016 2.46
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
1240 1.52 11 1.4
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical. Read More
Paste 1.00 E-03 TDS
Electro-Bond F3 2 $9.99 Room Temp / Heat Cure 100/15 90 Minutes 1 Year Nickel Nickel N/A
Designed for flexible circuits application, elect... Designed for flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components. Read More
N/A 3200 24 hours @ Room Temp 2 to 4 hours @ 60°C N/A N/A N/A N/A N/A 60 65 125 1300 from –50 to +150°C N/A N/A N/A 44 N/A
N/A
N/A 100 0.003 2.79
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
1250 1.44 10 N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. Read More
Paste <0.004 TDS
Thermo-Bond 58 2 $9.99 Room Temp / Heat Cure 100/38 2 Hours 1 Year Grey Alumina N/A
Staking transistors, diodes, resistors, integrated... Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. Read More
N/A 8500 24 hours @ Room Temp 2 to 4 hours @ 60°C N/A 6 410 N/A N/A N/A 60 125 1850 from –50 to +125°C N/A N/A N/A 44 N/A
N/A
N/A 100 N/A 2.3
metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
3500 0.82 N/A N/A
Staking transistors, diodes, resistors, integrated... Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards Read More
Paste 2.0 E+15 TDS
Electro-Bond 63 1 $14.99 Heat Cure N/A 6 Months 6 Months Grey Graphite N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry Read More
N/A 11000 1 hour @ 120 C N/A N/A N/A N/A N/A N/A 80 170 2600 from –50 to +170°C N/A N/A N/A 42 Micron N/A
N/A
N/A 100 0.003 1.28
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
3600 0.25 1.7 N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. Read More
Paste 43 TDS
Electro-Bond 62 2 $14.99 Room Temp / Heat Cure 100/10 40 Minutes 1 Year Grey Graphite N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry, Read More
N/A 11000 24 hours @ Room Temp 2 to 4 hours @ 60°C N/A N/A N/A N/A N/A 30 78 100 2300 from –50 to +110°C N/A N/A N/A 42 Micron N/A
N/A
N/A 100 0.003 1.29
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
3400 0.24 1.7 N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. Read More
Paste 0.004 TDS
Electro-Bond 24 2 $18.99 Room Temp / Heat Cure 100/5 180 Minutes 1 Year Silver Silver N/A
For electronics applications, for the assembly line manufacturing, for high RF shieldings.
N/A 3500 24 hours @ Room Temp 2 to 4 hours @ 60°C N/A N/A N/A N/A N/A 92 84 190 1270 from –50 to +190°C N/A N/A N/A Less than 2 Microns N/A
N/A
N/A 100 0.003 2.63
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
1270 1.5 10.4 N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. Read More
Paste 2.00 E-03 TDS
Electro-Bond 07 2 $1.99 Room Temp / Heat Cure 100/100 45 Minutes 1 Year Silver Silver N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry. Read More
N/A 13500 24 hours @ Room Temp 2 to 4 hours @ 60°C N/A 4.1 460 N/A N/A 50 85 170 1250 From –50 To +170°C N/A N/A N/A 44 N/A
N/A
N/A 100 0.0029 2.62
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
9500 1.56 11.2 1.5
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical Read More
Paste 1.00 E-03 TDS
Electro-Bond 06 2 $11.99 Room Temp / Heat Cure 100/5 60 Minutes 1 Year Silver Silver N/A
For high strength application, electrical properti... For high strength application, electrical properties, perfect bond, cold solder for heat sensitive components. Read More
N/A 13700 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C N/A N/A N/A N/A N/A 60 83 90 8500 from –50 to +130°C N/A N/A N/A 40 N/A
N/A
N/A 100 0.004 2.59
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
8900 18.37 18.37 0.49
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical Read More
Paste 1.70 E-03 TDS
Electro-Bond G298 2 $499.99 Room Temp Or Heat Cure 100/4 30 Minutes 1 Year In Syringes And 3 Months In Pouches/bi-paks Gold Gold N/A
This product is used in high-end aerospace and med... This product is used in high-end aerospace and medical equipment to prevent cross-linking in high voltage / Amperage applications. Read More
N/A 13000 15 minutes @ 120°C / 248 °F 90 minutes @ 80°C / 176 °F 10 hours @ 50°C / 122 °F 24 hours @ 25°C / 77 °F N/A N/A @ 23°C: ≥ 5 Kg / 1,700 psi N/A N/A ≥ 100°C (Dynamic Cure 20—200°C /ISO 25 Min; Ramp- 10—200°C @ 20°C/Min 87 175 1000 from –50 to +130°C N/A N/A N/A 50 N/A
N/A
N/A N/A 0.003 N/A
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
N/A N/A N/A N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical Read More
Paste @ 23°C: ≤ 0.0009 Ohm-cm TDS
Electro-Bond 01 1 $18.99 Heat Cure N/A 6 Months 6 Months Silver Silver N/A
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry, Read More
N/A 12000 2 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °C N/A N/A N/A N/A N/A N/A 83 175 8700 from –50 to +170°C N/A N/A N/A 40 N/A
N/A
N/A N/A N/A 2.79
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
8700 2.65 18.37 0.49
EMI & RFI shielding, in the assembly or repair... EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry Read More
Paste 1.70 E-04 TDS
test N/A $0.25 N/A N/A N/A N/A N/A N/A N/A
N/A
N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A
N/A
N/A N/A N/A N/A
N/A
N/A N/A N/A N/A
N/A
N/A N/A TDS
Thermo-Bond 54 2 $9.99 Heat Cure / Room Temp Cure 100/6 3 Hours 1 Year Grey Alumina N/A
Staking transistors, diodes, resistors, integrated... Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. Read More
N/A 6500 2 hrs @ 65°C +1hr @ 130 °C 2 hrs @ 65°C +2 hrs @100°C 48 hrs @ Room Temp N/A 6 425 N/A N/A 130 94 130 2000 from –50 to +160°C N/A N/A N/A 44 N/A
N/A
N/A 100 10.1 2.43
metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
3200 1 6.94 N/A
Staking transistors, diodes, resistors, integrated... Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards Read More
120000 5.00 E+15 TDS
Thermo-Bond 180 2 $9.99 Heat Cure 100/10 90 Minutes 1 Year Black Alumina N/A
Very long pot life, heat curing for large casting ... Very long pot life, heat curing for large casting and those applications requiring optimum properties with operating temperature up 425F. Read More
N/A 15000 10 hours @ 175 °F 3 hours @ 225°F N/A 4.4 485 0.015 N/A N/A 90 175 8800 from –50 to +150°C N/A N/A N/A 44 N/A
N/A
N/A 100 0.003 1.9
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
8800 1.44 10 14
Very long pot life heat curing for large casting a... Very long pot life heat curing for large casting and those applications requiring optimum properties with operating temperature up 425F Read More
55000 1.5 E15 TDS
Thermo-Bond 56 2 $9.99 Room Temp 100/23 5 Minutes 1 Year Grey Alumina N/A
Fast Cure, Strong Bond, durable High Impact Bonds at room temperature.
N/A 10000 60 minutes @ Room Temp N/A N/A N/A N/A N/A 33 C 78 160 3400 from –50 to +110°C N/A N/A N/A 44 N/A
N/A
N/A 100 N/A 2.25
metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
3400 0.84 5.83 14.4
Fibers optic, potting and connectors
12,000 5.40 E+15 TDS
Thermo-Bond 90 2 $9.99 Room Temp 100/5 90 Minutes 1 Year Black Alumina N/A
Shorter pot life, fast room temperature curative f... Shorter pot life, fast room temperature curative for casting Up to 1.5 inches thick and operating temperature Up to 300 F Read More
N/A 15000 8 hours @ Room Temp 2 hours @ 60 °C N/A 4.4 485 0.015 N/A N/A 90 175 8800 from –50 to +150°C N/A N/A N/A 44 N/A
N/A
N/A 100 0.003 1.9
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
8800 1.00 N/A 14
Shorter pot life fast room temperature curative fo... Shorter pot life fast room temperature curative for casting Up to 1.5 inches thick and operating temperature Up to 300 F Read More
55000 1.50 E15 TDS
Thermo-Bond 110 2 $9.99 Room Temp 100/5 2 Hours 1 Year Black Alumina N/A
Formulated to meet those applications which requir... Formulated to meet those applications which require electrical, physical and thermal properties with a service temperature Up to 205C Read More
N/A 17000 24 hrs@ room temperature 10 min@ 175 °F 3 min@ 225°F N/A 6.4 560 0.018 N/A N/A 92 175 8500 from –50 to +205°C N/A N/A N/A 44 N/A
N/A
N/A 100 0.001 2.3
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
8500 1.66 11.5 30
is designed to meet those applications which requi... is designed to meet those applications which require electrical, physical and thermal properties with a service temperature Up to 205C Read More
3000 4.90E+16 TDS
Thermo-Bond 53 2 $9.99 Room Temp / Heat Cure 100/7 45 Minutes 1 Year Grey Alumina N/A
Staking transistors, diodes, resistors, integrated... Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. Read More
N/A 11000 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C N/A 6 N/A 410 N/A 110 C 87 175 8200 from –50 to +170°C N/A N/A N/A 44 N/A
N/A
N/A 100 N/A 2.45
metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
8200 1 6.92 14
Fibers optic, potting and connectors
Paste 5.40 E+15 TDS
Thermo-Bond 95 2 $17.99 Room Temp / Heat Cure 100/15 60 Minutes 1 Year Off White Boron Nitride N/A
Intended for electronics applications, for the ass... Intended for electronics applications, for the assembly line manufacturing, Heat Transfers components. Read More
N/A 6500 24 hours @ Room Temp 2 to 4 hours @ 60°C N/A N/A N/A N/A N/A 54 80 175 1250 from –50 to +170°C 0.02 0.6 N/A 45 N/A
N/A
N/A 100 0.003 1.30
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
3400 0.46 3.2 N/A
Staking transistors, diodes, resistors, integrated... Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards Read More
Paste 3.4 E+15 TDS
Thermo-Bond 26 2 $9.99 Room Temp / Heat Cure 100/14 50 Minutes 1 Year Grey Alumina N/A
Designed for electronics applications, for the ass... Designed for electronics applications, for the assembly line manufacturing, Heat Transfers components. Read More
N/A 9,500 25 hours @ Room Temp 2 to 4 hours @ 60°C N/A N/A 410 N/A N/A 113 82 170 1750 from –50 to +135°C N/A N/A N/A 45 N/A
N/A
N/A 100 0.0012 2.35
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
1750 0.46 3.2 N/A
Staking transistors, diodes, resistors, integrated... Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards Read More
Paste 3.4 E+15 TDS
Thermo-Bond 24 2 $9.99 Room Temp 100/7 30 Minutes 1 Year Black Alumina N/A
Designed for applications requiring room temperatu... Designed for applications requiring room temperature curing, lowest viscosity and best handling properties with a service temperature Up to 150C. Will soften slightly above 121C. Read More
N/A 17000 24 hours @ Room Temp 3 hours @ 65 °C N/A 6.4 560 0.018 N/A N/A 92 175 8500 from –50 to +150°C N/A N/A N/A 44 N/A
N/A
N/A 100 0.001 2.3
aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
8500 1.66 11.5 30
is designed for applications requiring room temper... is designed for applications requiring room temperature curing, lowest viscosity and best handling properties with a service temperature Up to 150C. Will soften slightly above 121C Read More
15000 4.90 E16 TDS
Thermo-Grease 04 N/A $9.99 N/A N/A N/A 2 Years Off White Zinc Oxide Silicone
N/A
N/A N/A cure_schedule N/A 4.4 390 N/A N/A N/A N/A N/A N/A -40 to 190°C N/A N/A N/A N/A N/A
Thermal coupler for any heat sink device temperatu... Thermal coupler for any heat sink device temperature sensors, power transistors, thermal joints, for any device where efficient cooling is required. Read More
15 N/A N/A 2.46
N/A
N/A 0.9 N/A N/A
N/A
Paste 2.9 E+14 TDS
Thermo-Bond 51 2 $12.99 Room Temp / Heat Cure 100/9 40 Minutes 1 Year Grey Alumina N/A
Staking transistors, diodes, resistors, integrated... Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. Read More
N/A 10000 24 hours @ Room Temp 3 hours @ 65°C N/A N/A N/A N/A N/A 60 89 115 7500 from –50 to +125°C N/A N/A N/A 44 N/A
N/A
N/A 100 0.003 2.3
Metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
7500 0.92 6.52 14.4
Fibers optic, potting and connectors
40,000 2.10 E+15 TDS
ConductiveX Repair Kit 2 $1.99 Room Temperature 100/5 6 Minutes 6 Months Silver Silver N/A
Designed For fast cure rear Window Defroster, Grid Repair and Tab adhesives.
N/A 13400 4 hours @ Room Temp 10 minutes @ 60 °C N/A N/A N/A N/A N/A 60 83 95 9400 From -20 to +200°F N/A N/A N/A 44 N/A
N/A
N/A 100 0.003 2.64
Glass, aluminum, Steel Bronze and ceramic
2200 1.46 10 N/A
Back Glass Defroster power tab antenna repair and electrically conductive components repair.
Paste 1.00 E-03 TDS