Carbon Filled Electrically Conductive High Strength Epoxy Coating Adhesive Dissipates Electrostatic

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Product Code: Electro-Bond 61

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Carbon Filled Electrically Conductive High Strength Epoxy Coating Adhesive Dissipates Electrostatic

Description

Electro-Bond 61 is an epoxy adhesive and coating formulation based on conductive carbon . Electro-Bond 61 is recommended for electronic bonding and sealing applications that required both electrical and mechanical properties. Electro-Bond 61 cures at room temperature or can be accelerated with mild heat to form strong bond between similar and dissimilar substrates.

Typical Properties
Components	2
Mix Ratio	100/10
Working Life @ 25°C	30 Minutes
Particle Size	25
Shelf Life	1 year
Cure Type	Room Temp / Heat Cure
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.

Physical Properties
Appearance	Black
Filler	Carbon
Viscosity	Paste
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI	12000
Specific Gravity @ 25°C	1.18
Hardness	80
Lap Shear Strength	1850
Reactive Solids Content, %	100
Shrinkage Linear, IN/IN	0.003
Tensile Strength, PSI	3500

Electrical Properties
Volume Resistivity	< 40 ohm. cm

Thermal Properties
Operating Temp	from –50 to +100°C
Glass Transition Temp (Tg)	30°C
Thermal Expansion Coefficient, per °C
Heat Distortion, °C	100
Thermal Conductivity W/M-K	0.25
Thermal Conductivity BTU-IN/HR-FT²-°F	1.8

TDS / SDS

TDS | SDS

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