Copper & Silver Thermally Conductive Epoxy Electrically Conductive Adhesive EMI RFI Shielding

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Brand: ConductiveX
Product Code: Electro-Bond 13

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Copper & Silver Thermally Conductive Epoxy Electrically Conductive Adhesive EMI RFI Shielding

Description

Electro-Bond 13 is two parts epoxy high formulations for bonding and coating electronics parts . Electro-Bond 13 is special formulations for EMI & RFI shielding and in the assembly or repair of printed circuits boards, wave guides and electronics parts. Electro-Bond 13 is room temperature cure or can be accelerated by mild heat for faster cure.

Typical Properties
Components	2
Mix Ratio	100/10
Working Life @ 25°C	30 Minutes
Particle Size	45
Shelf Life	1 year
Cure Type	Room Temp / Heat Cure
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.

Physical Properties
Appearance	Grey
Filler	Silver/Copper
Viscosity	Paste
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI	3500
Specific Gravity @ 25°C	2.32
Hardness	80
Lap Shear Strength	940 PSI
Reactive Solids Content, %	100
Shrinkage Linear, IN/IN	0.003
Tensile Strength, PSI	1650

Electrical Properties
Volume Resistivity	3.70 E-2 ohm. cm
Dielectric Constant	4.2
Dielectric Strength	410
Dissipation Factor KV/IN	0.015

Thermal Properties
Operating Temp	from –50 to +170°C
Glass Transition Temp (Tg)	60°C
Thermal Expansion Coefficient, per °C	30
Heat Distortion, °C	150
Thermal Conductivity W/M-K	1.15
Thermal Conductivity BTU-IN/HR-FT²-°F	8

TDS / SDS

TDS | SDS

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