Electrically & Thermally Conductive 1 Part Silver Epoxy Heat Cure High Temp 325F

Electro-Bond 04 is a single component, heat curing, conductive epoxy polymer that was designed for ease in handling. This high performance conductive polymer cures quickly at elevated temperatures making it ideally suited for rapid processing and assembly. Electro-Bond 04 passes NASA’s outgassing testing (ASTM E-595) and is listed in NASA’s Outgassing Data for Selecting Spacecraft Materials list.Electro-Bond 04 offers excellent mechanical, electrical, and physical properties at continuous operating temperatures Up to 175°C. This versatile silver conductive adhesive can be used for chip bonding in micro and opto-electronic hybrid circuit fabrication. This high performance conductive polymer also exhibits outstanding adhesion to a wide variety of substrates with good hot strength at intermittent temperatures Up to 325°F."

Typical Properties
Components	1
Working Life @ 25°C	6 months
Particle Size	17
Shelf Life	6 months
Cure Type	Heat Cure
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, and circuitry
Physical Properties
Appearance	Silver
Filler	Silver
Viscosity	Paste
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Outgassing, NASA %CVCM	0.01
Outgassing, NASA %TML	0.38
Outgassing, NASA %WVR	0.07
Compressive Strength, PSI	12000
Specific Gravity @ 25°C	2.69
Hardness	87
Lap Shear Strength	8500
Reactive Solids Content, %	100
Tensile Strength, PSI	8500
Electrical Properties
Volume Resistivity	1.00 E-03 ohm. cm
Thermal Properties
Operating Temp	from –50 to +204°C
Glass Transition Temp (Tg)
Thermal Expansion Coefficient, per °C	0.49
Heat Distortion, °C	175
Thermal Conductivity W/M-K	2.99
Thermal Conductivity BTU-IN/HR-FT²-°F	20.74