Flexible Nickel Epoxy Electrically Conductive Conductivity Nickel Filled Adhesive EMI RFI Sheilding

Flexible Nickel Epoxy Electrically Conductive Conductivity Nickel Filled Adhesive EMI RFI Sheilding
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  • Brand: ConductiveX
  • Product Code: Electro-Bond F3
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Flexible Nickel Epoxy Electrically Conductive Conductivity Nickel Filled Adhesive EMI RFI Sheilding
This product has been replaced by Electro-Bond 03 which you may order at the link below:

Electro-Bond 03 Order Link

Electro-Bond F3 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 3.8x10-2 ohm-cm. Electro-Bond F3 has been used extensively in such diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.




Typical Properties

Components 2
Mix Ratio 100/15
Working Life @ 25°C 90 Minutes
Particle Size 44
Shelf Life 1 year
Cure Type Room Temp / Heat Cure
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.

Physical Properties

Appearance Nickel
Filler Nickel
Viscosity Paste
Substrates aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI 3200
Specific Gravity @ 25°C 2.79
Hardness 65
Lap Shear Strength 1300
Reactive Solids Content, % 100
Shrinkage Linear, IN/IN 0.003
Tensile Strength, PSI 1250

Electrical Properties

Volume Resistivity <0.004 ohm. cm

Thermal Properties

Operating Temp from –50 to +150°C
Glass Transition Temp (Tg) 60
Thermal Expansion Coefficient, per °C
Heat Distortion, °C 125
Thermal Conductivity W/M-K 1.44
Thermal Conductivity BTU-IN/HR-FT²-°F 10
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