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- Brand: ConductiveX
- Product Code: Electro-Bond F3
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Flexible Nickel Epoxy Electrically Conductive Conductivity Nickel Filled Adhesive EMI RFI Sheilding
This product has been replaced by Electro-Bond 03 which you may order at the link below:
Electro-Bond F3 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 3.8x10-2 ohm-cm. Electro-Bond F3 has been used extensively in such diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.
Typical Properties |
|
Components | 2 |
Mix Ratio | 100/15 |
Working Life @ 25°C | 90 Minutes |
Particle Size | 44 |
Shelf Life | 1 year |
Cure Type | Room Temp / Heat Cure |
Typical Applications | |
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. | |
Physical Properties |
|
Appearance | Nickel |
Filler | Nickel |
Viscosity | Paste |
Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
Density @ 25°C | |
Compressive Strength, PSI | 3200 |
Specific Gravity @ 25°C | 2.79 |
Hardness | 65 |
Lap Shear Strength | 1300 |
Reactive Solids Content, % | 100 |
Shrinkage Linear, IN/IN | 0.003 |
Tensile Strength, PSI | 1250 |
Electrical Properties |
|
Volume Resistivity | <0.004 ohm. cm |
Thermal Properties |
|
Operating Temp | from –50 to +150°C |
Glass Transition Temp (Tg) | 60 |
Thermal Expansion Coefficient, per °C | |
Heat Distortion, °C | 125 |
Thermal Conductivity W/M-K | 1.44 |
Thermal Conductivity BTU-IN/HR-FT²-°F | 10 |
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