Highly Conductive Pure Silver Epoxy Elecrically Conductive Adhesive Easy 1 to 1 Mix Ratio Dispensing

Electro-Bond 07 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm·cm. Electro-Bond 07 is also characterized by a wide operating temperature range from –50 to +170°C. Electro-Bond 07 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties.

Typical Properties
Components	2
Mix Ratio	100/100
Working Life @ 25°C	45 Minutes
Particle Size	44
Shelf Life	1 year
Cure Type	Room Temp / Heat Cure
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical
Physical Properties
Appearance	Silver
Filler	Silver
Viscosity	Paste
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI	13500
Specific Gravity @ 25°C	2.62
Hardness	85
Lap Shear Strength	1250
Reactive Solids Content, %	100
Shrinkage Linear, IN/IN	0.0029
Tensile Strength, PSI	9500
Electrical Properties
Volume Resistivity	1.00 E-03 ohm. cm
Dielectric Constant	4.1
Dielectric Strength	460
Thermal Properties
Operating Temp	From –50 To +170°C
Glass Transition Temp (Tg)	50
Thermal Expansion Coefficient, per °C	1.5
Heat Distortion, °C	170
Thermal Conductivity W/M-K	1.56
Thermal Conductivity BTU-IN/HR-FT²-°F	11.2