Electrically Conductive Nickel Epoxy, Medium Conductivity, High Viscosity Room Temp Cure

Electrically Conductive Nickel Epoxy, Medium Conductivity, High Viscosity Room Temp Cure
  • Views: 45254
  • Brand: ConductiveX
  • Product Code: Electro-Bond 03
  • Availability: In Stock
  • $0.00

Available Options

Electro-Bond 03 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an lectrical resistivity value of less than 3.8x10-2 ohm-cm. Electro-Bond 03 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties. Electro-Bond 03 has been used extensively in such diversified applications as icrowave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical."


Typical Properties

Components 2
Mix Ratio 100/5
Working Life @ 25°C 60 Minutes
Hardness, Shore D 85
Particle Size 40
Shelf Life 1 year
Cure Type Room Temp / Heat Cure
Cure Schedule 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C
Benefits
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.

Physical Properties

Appearance Grey
Filler Nickel
Viscosity Paste
Substrates aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI 13500
Specific Gravity @ 25°C 2.69
Hardness 85
Lap Shear Strength 1100
Reactive Solids Content, % 100
Shrinkage Linear, IN/IN 0.003
Tensile Strength, PSI 8900

Electrical Properties

Volume Resistivity <0.038 ohm. cm

Thermal Properties

Thermal Conductivity @ 25 °C
Operating Temp from –50 to +170°C
Glass Transition Temp (Tg) 60°C
Thermal Expansion Coefficient, per °C 0.45
Heat Distortion, °C 130
Thermal Conductivity W/M-K 1.44
Thermal Conductivity BTU-IN/HR-FT²-°F 10

Tags: conductive epoxy, conductive adhesives, Nickel epoxy, Nickel epoxies, Nickel adhesive, Nickel adhesives