Electrically Conductive Nickel Epoxy, Medium Conductivity, High Viscosity Room Temp Cure
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Electro-Bond 03 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an lectrical resistivity value of less than 3.8x10-2 ohm-cm. Electro-Bond 03 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties. Electro-Bond 03 has been used extensively in such diversified applications as icrowave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical."
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 100/5 |
| Working Life @ 25°C | 60 Minutes |
| Hardness, Shore D | 85 |
| Particle Size | 40 |
| Shelf Life | 1 year |
| Cure Type | Room Temp / Heat Cure |
| Cure Schedule | 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C |
| Benefits | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical. | |
| Typical Applications | |
| EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical. | |
Physical Properties |
|
| Appearance | Grey |
| Filler | Nickel |
| Viscosity | Paste |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 13500 |
| Specific Gravity @ 25°C | 2.69 |
| Hardness | 85 |
| Lap Shear Strength | 1100 |
| Reactive Solids Content, % | 100 |
| Shrinkage Linear, IN/IN | 0.003 |
| Tensile Strength, PSI | 8900 |
Electrical Properties |
|
| Volume Resistivity | <0.038 ohm. cm |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +170°C |
| Glass Transition Temp (Tg) | 60°C |
| Thermal Expansion Coefficient, per °C | 0.45 |
| Heat Distortion, °C | 130 |
| Thermal Conductivity W/M-K | 1.44 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 10 |
