Electrically & Thermally Conductive Silver Epoxy Adhesive Cold Solder Replacement High Strength

Electrically & Thermally Conductive Silver Epoxy Adhesive Cold Solder Replacement High Strength
  • Views: 84244
  • Product Code: Electro-Bond 02
  • Availability: In Stock
  • $0.00

Available Options

Electro-Bond 02 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. Electro-Bond 02 is two-part, smooth paste formulation of refined pure silver and epoxy is free of solvents and copper or carbon additives. It develops strong, durable, electrically and thermally conducting bonds and coatings between many different and dissimlar materials such as metals, ceramics, glass and plastic laminates.Electro-Bond 02 cures at room temperature and can be used as a cold solder for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, printed circuits, wave guides, flat cables and high frequency shields. "

Typical Properties

Components 2
Mix Ratio 100/5
Working Life @ 25°C 60 Minutes
Hardness, Shore D 85
Particle Size 17
Shelf Life 1 year
Cure Type Room Temp / Heat Cure
Cure Schedule 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C
Formulated for high strength application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components.
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.

Physical Properties

Appearance Silver
Filler Silver
Viscosity Paste
Substrates aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Outgassing, NASA %CVCM 0
Outgassing, NASA %TML 0.62
Outgassing, NASA %WVR 0.13
Compressive Strength, PSI 13000
Specific Gravity @ 25°C 2.79
Hardness 85
Lap Shear Strength 1400
Reactive Solids Content, % 100
Shrinkage Linear, IN/IN 0.003
Tensile Strength, PSI 880

Electrical Properties

Volume Resistivity 6.00 E-04 ohm. cm

Thermal Properties

Thermal Conductivity @ 25 °C
Operating Temp from –50 to +130°C
Glass Transition Temp (Tg) 60°C
Thermal Expansion Coefficient, per °C 0.49
Heat Distortion, °C 175
Thermal Conductivity W/M-K 2.99
Thermal Conductivity BTU-IN/HR-FT²-°F 20.73

Tags: conductive epoxy, conductive adhesives, carbon epoxy, carbon epoxies, carbon adhesive, carbon adhesives