Carbon Filled Electrically Conductive High Strength Epoxy Coating Adhesive Dissipates Electrostatic

Carbon Filled Electrically Conductive High Strength Epoxy Coating Adhesive Dissipates Electrostatic
  • Views: 42575
  • Product Code: Electro-Bond 61
  • Availability: In Stock
  • $0.00

Available Options

Electro-Bond 61 is an epoxy adhesive and coating formulation based on conductive carbon . Electro-Bond 61 is recommended for electronic bonding and sealing applications that required both electrical and mechanical properties. Electro-Bond 61 cures at room temperature or can be accelerated with mild heat to form strong bond between similar and dissimilar substrates.


Typical Properties

Components 2
Mix Ratio 100/10
Working Life @ 25°C 30 Minutes
Hardness, Shore D 80
Particle Size 25
Shelf Life 1 year
Cure Type Room Temp / Heat Cure
Cure Schedule 24 hours @ Room Temp 2 to4 hours @ 60°C
Benefits
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.

Physical Properties

Appearance Black
Filler Carbon
Viscosity Paste
Substrates aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI 12000
Specific Gravity @ 25°C 1.18
Hardness 80
Lap Shear Strength 1850
Reactive Solids Content, % 100
Shrinkage Linear, IN/IN 0.003
Tensile Strength, PSI 3500

Electrical Properties

Volume Resistivity < 40 ohm. cm

Thermal Properties

Thermal Conductivity @ 25 °C
Operating Temp from –50 to +100°C
Glass Transition Temp (Tg) 30°C
Thermal Expansion Coefficient, per °C
Heat Distortion, °C 100
Thermal Conductivity W/M-K 0.25
Thermal Conductivity BTU-IN/HR-FT²-°F 1.8

Tags: conductive epoxy, conductive adhesives, carbon epoxy, carbon epoxies, carbon adhesive, carbon adhesives