Silver Mixed Epoxy, Electrically Conductive Adhesive, EMI RFI Sheilding System, 1 Part Heat Cure

Silver Mixed Epoxy, Electrically Conductive Adhesive, EMI  RFI Sheilding System, 1  Part Heat Cure
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  • Brand: ConductiveX
  • Product Code: Electro-Bond G2
  • Availability: In Stock
  • $0.00

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Electro-Bond G2 represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based on a silver coated ceramic that results in lower material costs without adversely sacrificing the properties obtained with a pure silver formulation. This concept opens the door to a wide range of applications previously prohibited by the much higher cost of conventional silver conductive. Electro-Bond G2 cures only with heat at 120C or higher to form a tenacious bond between similar and dissimilar substrates such as aluminum, copper, magnesium, steel, bronze nickel, ceramic, glass, phenolic, and G-10 epoxy glass boards. because of its excellent continuity, has been used extensively in such diversified applications as, microwave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, high frequency shields, connections, and circuitry and as a cold solder. This unique formulation offers ease in handling due to its creamy consistency and versatile application by hand, automatic dispenser, silk-screening, transfer or stamping techniques. "


Typical Properties

Components 1
Working Life @ 25°C 6 months
Hardness, Shore D 83
Particle Size 40
Shelf Life 6 months
Cure Type Heat Cure
Cure Schedule 2 hours @ 120 °C 1 hour @ 150 °C 1/2 hour @ 175 °C
Benefits
Designed for high strength application, electrical properties with perfect bonding.
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry

Physical Properties

Appearance Silver
Filler Silver
Viscosity Paste
Substrates aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI 12000
Specific Gravity @ 25°C 2.59
Hardness 83
Lap Shear Strength 8700
Reactive Solids Content, % 2.59
Tensile Strength, PSI 8700

Electrical Properties

Volume Resistivity 1.70 E-04 ohm. cm

Thermal Properties

Thermal Conductivity @ 25 °C
Operating Temp from –50 to +204°C
Glass Transition Temp (Tg)
Thermal Expansion Coefficient, per °C 0.49
Heat Distortion, °C 175
Thermal Conductivity W/M-K 2.65
Thermal Conductivity BTU-IN/HR-FT²-°F 18.37

Tags: conductive epoxy, conductive adhesives, Silver epoxy, silver epoxies, silver adhesive, silver adhesives, flexible conductive silver, flexible conductive adhesive