Thermally Conductive Electrically Insulating Heat Cure Epoxy High Temperature Resistance

Thermally Conductive  Electrically Insulating Heat Cure Epoxy High Temperature Resistance
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  • Brand: ConductiveX
  • Product Code: Thermo-Bond 54
  • Availability: In Stock
  • $0.00

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Thermo-Bond 54 is recommended for high temperature aerospace and electronic applications where the combination of good thermal conductivity AND low electrical conductivity is required for thermal links (staking electrical components -- diodes, integrated circuits, transistors, precision resistors, or capacitors -- to chassis or circuit boards). This two-part thixotropic epoxy system is color coded for easy handling and mixing at room temperature -- although a final high temperature bake at 100°C is REQUIRED for full cure. Thermo-Bond 54 bonds strongly to ceramics (alumina, porcelain and beryllia), to glass and to many metals and plastics, and its thermal expansion coefficient is a good match for many other electronic materials (i.e. copper and aluminum) over a wide temperature range. The fully cured adhesive develops strong, durable electrically insulating/thermal conducting bonds with good impact properties, and which are also resistant to galvanic action, weathering, water, salts, mild alkalis and acids, many petroleum products, and many other organic and inorganic compounds. An additional post-cure of 4 hours at 145°C is recommended when application temperatures higher than 145°C are anticipated.


Typical Properties

Components 2
Mix Ratio 100/6
Working Life @ 25°C 3 hours
Hardness, Shore D 94
Particle Size 44
Shelf Life 1 year
Cure Type Heat Cure / Room Temp Cure
Cure Schedule 2 hrs @ 65°C +1hr @ 130 °C 2 hrs @ 65°C +2 hrs @100°C 48 hrs @ Room Temp
Benefits
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.
Typical Applications
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards

Physical Properties

Appearance Grey
Filler Alumina
Viscosity 120000
Substrates metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
Density @ 25°C
Compressive Strength, PSI 6500
Specific Gravity @ 25°C 2.43
Hardness 94
Lap Shear Strength 2000
Reactive Solids Content, % 100
Shrinkage Linear, IN/IN 10.1
Tensile Strength, PSI 3200

Electrical Properties

Volume Resistivity 5.00 E+15 ohm. cm
Dielectric Constant 6
Dielectric Strength 425

Thermal Properties

Thermal Conductivity @ 25 °C
Operating Temp from –50 to +160°C
Glass Transition Temp (Tg) 130
Thermal Expansion Coefficient, per °C
Heat Distortion, °C 130
Thermal Conductivity W/M-K 1
Thermal Conductivity BTU-IN/HR-FT²-°F 6.94