Thermally Conductive Epoxy High Heat Transfer Adhesive Electrically Insulating Boron Nitride Filled
Thermo-Bond 95 is a two components, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards. This adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. Thermo-Bond 95 bonds readily to itself and to metals, silica, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured Thermo-Bond 95 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 100/15 |
| Working Life @ 25°C | 60 Minutes |
| Hardness, Shore D | 80 |
| Particle Size | 45 |
| Shelf Life | 1 year |
| Cure Type | Room Temp / Heat Cure |
| Cure Schedule | 24 hours @ Room Temp 2 to 4 hours @ 60°C |
| Benefits | |
| Intended for electronics applications, for the assembly line manufacturing, Heat Transfers components. | |
| Typical Applications | |
| Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards | |
Physical Properties |
|
| Appearance | Off White |
| Filler | Boron Nitride |
| Viscosity | Paste |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Outgassing, NASA %CVCM | 0.02 |
| Outgassing, NASA %TML | 0.6 |
| Compressive Strength, PSI | 6500 |
| Specific Gravity @ 25°C | 1.30 |
| Hardness | 80 |
| Lap Shear Strength | 1250 |
| Reactive Solids Content, % | 100 |
| Shrinkage Linear, IN/IN | 0.003 |
| Tensile Strength, PSI | 3400 |
Electrical Properties |
|
| Volume Resistivity | 3.4 E+15 ohm. cm |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +170°C |
| Glass Transition Temp (Tg) | 54 |
| Thermal Expansion Coefficient, per °C | |
| Heat Distortion, °C | 175 |
| Thermal Conductivity W/M-K | 0.46 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 3.2 |
