Flexible Thermally Conductive Adhesive Electrically Insulating Epoxy Low Thermal Expansion Cooling

Flexible Thermally Conductive Adhesive Electrically Insulating Epoxy Low Thermal Expansion  Cooling
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  • Brand: ConductiveX
  • Product Code: Thermo-Bond 58
  • Availability: In Stock
  • $0.00

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Thermo-bond 58 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. Thermo-Bond 58 bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured Thermo-Bond 58 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.


Typical Properties

Components 2
Mix Ratio 100/38
Working Life @ 25°C 2 hours
Hardness, Shore D 60
Particle Size 44
Shelf Life 1 year
Cure Type Room Temp / Heat Cure
Cure Schedule 24 hours @ Room Temp 2 to 4 hours @ 60°C
Benefits
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.
Typical Applications
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards

Physical Properties

Appearance Grey
Filler Alumina
Viscosity Paste
Substrates metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
Density @ 25°C
Compressive Strength, PSI 8500
Specific Gravity @ 25°C 2.3
Hardness 60
Lap Shear Strength 1850
Reactive Solids Content, % 100
Tensile Strength, PSI 3500

Electrical Properties

Volume Resistivity 2.0 E+15 ohm. cm
Dielectric Constant 6
Dielectric Strength 410

Thermal Properties

Thermal Conductivity @ 25 °C
Operating Temp from –50 to +125°C
Glass Transition Temp (Tg)
Thermal Expansion Coefficient, per °C
Heat Distortion, °C 125
Thermal Conductivity W/M-K 0.82

Tags: Thermally conductive epoxy, conductive adhesives, Alumina epoxy, Alumina epoxies, Alumina adhesive, Thermal adhesives, flexible thermally conductive, flexible conductive adhesive