Thermally Conductive Epoxy Paste Low NASA Outgassing Adhesive Thixotropic Electrically Insulating

Thermally Conductive Epoxy  Paste Low NASA Outgassing Adhesive Thixotropic  Electrically Insulating
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  • Brand: ConductiveX
  • Product Code: Thermo-Bond 53
  • Availability: In Stock
  • $0.00

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Thermo-Bond 53 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. Thermo-Bond 53 is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. Thermo-Bond 53 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials. Thermo-Bond 53 bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials.


Typical Properties

Components 2
Mix Ratio 100/7
Working Life @ 25°C 45 Minutes
Hardness, Shore D 87
Particle Size 44
Shelf Life 1 year
Cure Type Room Temp / Heat Cure
Cure Schedule 24 hours @ Room Temp 3 hours @ 65 °C 1 hour @ 120°C
Benefits
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.
Typical Applications
Fibers optic, potting and connectors

Physical Properties

Appearance Grey
Filler Alumina
Viscosity Paste
Substrates metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
Density @ 25°C
Compressive Strength, PSI 11000
Specific Gravity @ 25°C 2.45
Hardness 87
Lap Shear Strength 8200
Reactive Solids Content, % 100
Tensile Strength, PSI 8200

Electrical Properties

Volume Resistivity 5.40 E+15 ohm. cm
Dielectric Constant 6
Dissipation Factor KV/IN 410

Thermal Properties

Thermal Conductivity @ 25 °C
Operating Temp from –50 to +170°C
Glass Transition Temp (Tg) 110 C
Thermal Expansion Coefficient, per °C 14
Heat Distortion, °C 175
Thermal Conductivity W/M-K 1
Thermal Conductivity BTU-IN/HR-FT²-°F 6.92

Tags: conductive epoxy, conductive adhesives, Alumina epoxy, alumina epoxies, alumina adhesive, alumina adhesives