Electrically Conductive Silver Filled Adhesive Thermally Conductive Silver Epoxy 1 Part Heat Cure
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- Brand: ConductiveX
- Product Code: Electro-Bond 20
- Availability: In Stock
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Electro-Bond 20 is one part Electrically Conductive Adhesives, used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditional methods such as solder, are not practical. Electrically Conductive Adhesives are ideal for attaching temperature sensitive components, or providing electrical interconnections on non-solderable substrates, such as plastic and glass.
Typical Properties |
|
Components | 1 |
Working Life @ 25°C | 6 months |
Hardness, Shore D | 80 |
Particle Size | 44 |
Shelf Life | 6 months |
Cure Type | Heat Cure |
Cure Schedule | 1 hour @ 120 °C 15 min @ 150 °C 4 min @ 175 °C |
Benefits | |
Intended for electronics applications, for the assembly line manufacturing, for high RF shieldings. | |
Typical Applications | |
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. | |
Physical Properties |
|
Appearance | Silver |
Filler | Silver |
Viscosity | Paste |
Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
Density @ 25°C | |
Compressive Strength, PSI | 9,000 |
Specific Gravity @ 25°C | 2.61 |
Hardness | 80 |
Lap Shear Strength | 900 |
Reactive Solids Content, % | 100 |
Tensile Strength, PSI | 3,500 |
Electrical Properties |
|
Volume Resistivity | 3.00 E-4 ohm. cm |
Thermal Properties |
|
Thermal Conductivity @ 25 °C | |
Operating Temp | from –50 to +170°C |
Glass Transition Temp (Tg) | 42°C |
Thermal Expansion Coefficient, per °C | |
Heat Distortion, °C | 170 |
Thermal Conductivity W/M-K | 1.43 |
Thermal Conductivity BTU-IN/HR-FT²-°F | 10.2 |
Tags: conductive epoxy, conductive adhesives, Silver epoxy, silver epoxies, silver adhesive, silver adhesives