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- Brand: ConductiveX
- Product Code: Electro-Bond 17
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Flexible Highly Conductive Pure Silver Epoxy Elecrically Conductive Adhesive 1 to 1 Mix Dispense
Electro-Bond 17 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require flexibility coupled with good electrical and mechanical properties. Electro-Bond 17 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require flexibility coupled with good electrical and mechanical properties. Electro-Bond 17 cures at room temperature and can be used as a flexible ""cold-solder"" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, membrane switches, wave guides, flat cable and high frequency shields.
Typical Properties |
|
Components | 2 |
Mix Ratio | 100/100 |
Working Life @ 25°C | 60 Minutes |
Particle Size | 44 |
Shelf Life | 1 year |
Cure Type | Room Temp / Heat Cure |
Typical Applications | |
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical. | |
Physical Properties |
|
Appearance | Silver |
Filler | Silver |
Viscosity | Paste |
Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
Density @ 25°C | |
Compressive Strength, PSI | 6500 |
Specific Gravity @ 25°C | 2.46 |
Hardness | 63 |
Lap Shear Strength | 850 |
Reactive Solids Content, % | 100 |
Shrinkage Linear, IN/IN | 0.0016 |
Tensile Strength, PSI | 1240 |
Electrical Properties |
|
Volume Resistivity | 1.00 E-03 ohm. cm |
Dielectric Constant | 4 |
Dielectric Strength | 410 |
Thermal Properties |
|
Operating Temp | from –50 to +140°C |
Glass Transition Temp (Tg) | 35 |
Thermal Expansion Coefficient, per °C | 1.4 |
Heat Distortion, °C | 170 |
Thermal Conductivity W/M-K | 1.52 |
Thermal Conductivity BTU-IN/HR-FT²-°F | 11 |
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