Flexible Highly Conductive Pure Silver Epoxy Elecrically Conductive Adhesive 1 to 1 Mix Dispense

Electro-Bond 17 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require flexibility coupled with good electrical and mechanical properties. Electro-Bond 17 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require flexibility coupled with good electrical and mechanical properties. Electro-Bond 17 cures at room temperature and can be used as a flexible ""cold-solder"" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, membrane switches, wave guides, flat cable and high frequency shields.

Typical Properties
Components	2
Mix Ratio	100/100
Working Life @ 25°C	60 Minutes
Particle Size	44
Shelf Life	1 year
Cure Type	Room Temp / Heat Cure
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.
Physical Properties
Appearance	Silver
Filler	Silver
Viscosity	Paste
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI	6500
Specific Gravity @ 25°C	2.46
Hardness	63
Lap Shear Strength	850
Reactive Solids Content, %	100
Shrinkage Linear, IN/IN	0.0016
Tensile Strength, PSI	1240
Electrical Properties
Volume Resistivity	1.00 E-03 ohm. cm
Dielectric Constant	4
Dielectric Strength	410
Thermal Properties
Operating Temp	from –50 to +140°C
Glass Transition Temp (Tg)	35
Thermal Expansion Coefficient, per °C	1.4
Heat Distortion, °C	170
Thermal Conductivity W/M-K	1.52
Thermal Conductivity BTU-IN/HR-FT²-°F	11