Flexible Electrically & Thermally Conductive Silver Epoxy, Flexible Electronic Component Repair
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- Brand: ConductiveX
- Product Code: Electro-Bond 19
- Availability: In Stock
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Electro-Bond 19 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good electrical and mechanical properties. elector Bond 19 is two-part, smooth paste adhesive of refined pure silver and epoxy resin components. It is free of solvents and copper or carbon additives. It develops strong, durable, resilient, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic insulates.
Typical Properties |
|
Components | 2 |
Mix Ratio | 90/100 |
Working Life @ 25°C | 30 Minutes |
Hardness, Shore D | 78 |
Particle Size | 25 |
Shelf Life | 1 year |
Cure Type | Room Temp / Heat Cure |
Cure Schedule | 24 hours @ Room Temp 2 to 4 hours @ 60°C |
Benefits | |
For flexible circuits application, electrical and thermal properties, perfect bond, cold solder for heat sensitive components. | |
Typical Applications | |
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical. | |
Physical Properties |
|
Appearance | Silver |
Filler | Silver |
Viscosity | Paste |
Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
Density @ 25°C | |
Compressive Strength, PSI | 3200 |
Specific Gravity @ 25°C | 2.32 |
Hardness | 78 |
Lap Shear Strength | |
Reactive Solids Content, % | 100 |
Shrinkage Linear, IN/IN | 0.003 |
Tensile Strength, PSI | 2400 |
Electrical Properties |
|
Volume Resistivity | 1.00 E03 ohm. cm |
Thermal Properties |
|
Thermal Conductivity @ 25 °C | |
Operating Temp | from –50 to +170°C |
Glass Transition Temp (Tg) | 30°C |
Thermal Expansion Coefficient, per °C | |
Heat Distortion, °C | 110 |
Thermal Conductivity W/M-K | 1.5 |
Thermal Conductivity BTU-IN/HR-FT²-°F | 10.6 |
Tags: conductive epoxy, conductive adhesives, Silver epoxy, silver epoxies, silver adhesive, silver adhesives, flexible conductive silver, flexible conductive adhesive