Thermally Conductive FDA Food Grade Epoxy Medical Manufacturing Adhesive Staking Casting Bonding
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- Product Code: Thermo-Bond 26
- Availability: In Stock
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Thermo-Bond 26 is versatile food grade adhesive guaranteed a high strength bond. Thermo-Bond 26 is two parts adhesive used and cured at room temperature for bonding, repair applications by manufacturers of medical food preparation, processing and packaging equipment and devices.
Typical Properties |
|
Components | 2 |
Mix Ratio | 100/14 |
Working Life @ 25°C | 50 Minutes |
Hardness, Shore D | 82 |
Particle Size | 45 |
Shelf Life | 1 year |
Cure Type | Room Temp / Heat Cure |
Cure Schedule | 25 hours @ Room Temp 2 to 4 hours @ 60°C |
Benefits | |
Designed for electronics applications, for the assembly line manufacturing, Heat Transfers components. | |
Typical Applications | |
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards | |
Physical Properties |
|
Appearance | Grey |
Filler | Alumina |
Viscosity | Paste |
Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
Density @ 25°C | |
Compressive Strength, PSI | 9,500 |
Specific Gravity @ 25°C | 2.35 |
Hardness | 82 |
Lap Shear Strength | 1750 |
Reactive Solids Content, % | 100 |
Shrinkage Linear, IN/IN | 0.0012 |
Tensile Strength, PSI | 1750 |
Electrical Properties |
|
Volume Resistivity | 3.4 E+15 ohm. cm |
Dielectric Strength | 410 |
Thermal Properties |
|
Thermal Conductivity @ 25 °C | |
Operating Temp | from –50 to +135°C |
Glass Transition Temp (Tg) | 113 |
Thermal Expansion Coefficient, per °C | |
Heat Distortion, °C | 170 |
Thermal Conductivity W/M-K | 0.46 |
Thermal Conductivity BTU-IN/HR-FT²-°F | 3.2 |
Tags: conductive epoxy, conductive adhesives, FDA epoxy, FDA thermal epoxies, FDA adhesive, FDA Thermally Conductive adhesives