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Electro-Bond 16 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications t..
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Electro-Bond 17 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing a..
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This product has been replaced by Electro-Bond 03 which you may order at the link below:Electro-Bond 03 Order LinkElectro-Bond F3 is an epoxy adhesive..
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Thermo-bond 58 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other he..
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Electro-Bond 63 is one component graphite fille epoxy designed for Esd/Emi Shielding of semiconductor devices and electronics. Electro-Bond 63 can be ..
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Electro-Bond 62 is a two parts adhesives, graphite filled epoxy designed for Esd/Emi Shielding of semiconductor devices and electronics. Electro-Bond ..
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Electro-Bond 24 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electr..
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Electro-Bond 07 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of ..
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Electro-Bond 06 represents the newest technology since the introduction of electrically conductive silver compounds. This unique formulation is based ..
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AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packag..
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Electro-Bond 01 is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically co..
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Thermo-Bond 54 is recommended for high temperature aerospace and electronic applications where the combination of good thermal conductivity AND low el..
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