Thermally Conductive Flame Retardant UL-94-V0 Electrically Insulating Low Viscosity Epoxy Adhesive
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- Brand: ConductiveX
- Product Code: Thermo-Bond 24
- Availability: In Stock
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Thermo-Bond 24 is flame retardant and is designed to meet the rigid requirement of UL-94-V0. Thermo-Bond 24 is heavily filled alumina oxide epoxy formulations characterized by outstanding physical, electrical, insulation, and thermal dissipation properties which exhibit exceptional thermal conductivity, low thermal expansion, as well as excellent chemical and solvent resistance.
Typical Properties |
|
Components | 2 |
Mix Ratio | 100/7 |
Working Life @ 25°C | 30 Minutes |
Hardness, Shore D | 92 |
Particle Size | 44 |
Shelf Life | 1 year |
Cure Type | Room Temp |
Cure Schedule | 24 hours @ Room Temp 3 hours @ 65 °C |
Benefits | |
Designed for applications requiring room temperature curing, lowest viscosity and best handling properties with a service temperature Up to 150C. Will soften slightly above 121C. | |
Typical Applications | |
is designed for applications requiring room temperature curing, lowest viscosity and best handling properties with a service temperature Up to 150C. Will soften slightly above 121C | |
Physical Properties |
|
Appearance | Black |
Filler | Alumina |
Viscosity | 15000 |
Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
Density @ 25°C | |
Compressive Strength, PSI | 17000 |
Specific Gravity @ 25°C | 2.3 |
Hardness | 92 |
Lap Shear Strength | 8500 |
Reactive Solids Content, % | 100 |
Shrinkage Linear, IN/IN | 0.001 |
Tensile Strength, PSI | 8500 |
Electrical Properties |
|
Volume Resistivity | 4.90 E16 ohm. cm |
Dielectric Constant | 6.4 |
Dielectric Strength | 560 |
Dissipation Factor KV/IN | 0.018 |
Thermal Properties |
|
Thermal Conductivity @ 25 °C | |
Operating Temp | from –50 to +150°C |
Glass Transition Temp (Tg) | |
Thermal Expansion Coefficient, per °C | 30 |
Heat Distortion, °C | 175 |
Thermal Conductivity W/M-K | 1.66 |
Thermal Conductivity BTU-IN/HR-FT²-°F | 11.5 |
Tags: Thermally conductive epoxy, conductive adhesives, Alumina epoxy, alumina epoxies, alumina adhesive, alumina adhesives