Thermally Conductive Staking Epoxy Low NASA Outgassing Adhesive Electrically Insulating High-Impact
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- Brand: ConductiveX
- Product Code: Thermo-Bond 51
- Availability: In Stock
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Thermo-Bond 51 is a thixotropic (smooth paste) heat conductive epoxy system that passes the NASA Outgassing Specification (TML :0.65 CVCM:0.02 WVR:0.12). It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. Thermo-Bond 51 bonds readily to itself, and to metals, silica, satiate, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured Thermo-Bond 51 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.
Typical Properties |
|
Components | 2 |
Mix Ratio | 100/9 |
Working Life @ 25°C | 40 Minutes |
Hardness, Shore D | 89 |
Particle Size | 44 |
Shelf Life | 1 year |
Cure Type | Room Temp / Heat Cure |
Cure Schedule | 24 hours @ Room Temp 3 hours @ 65°C |
Benefits | |
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. | |
Typical Applications | |
Fibers optic, potting and connectors | |
Physical Properties |
|
Appearance | Grey |
Filler | Alumina |
Viscosity | 40,000 |
Substrates | Metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials |
Density @ 25°C | |
Compressive Strength, PSI | 10000 |
Specific Gravity @ 25°C | 2.3 |
Hardness | 89 |
Lap Shear Strength | 7500 |
Reactive Solids Content, % | 100 |
Shrinkage Linear, IN/IN | 0.003 |
Tensile Strength, PSI | 7500 |
Electrical Properties |
|
Volume Resistivity | 2.10 E+15 ohm. cm |
Thermal Properties |
|
Thermal Conductivity @ 25 °C | |
Operating Temp | from –50 to +125°C |
Glass Transition Temp (Tg) | 60 |
Thermal Expansion Coefficient, per °C | 14.4 |
Heat Distortion, °C | 115 |
Thermal Conductivity W/M-K | 0.92 |
Thermal Conductivity BTU-IN/HR-FT²-°F | 6.52 |
Tags: conductive epoxy, conductive adhesives, Alumina epoxy, alumina epoxies, alumina adhesive, alumina adhesives