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Thermo-bond 58 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other he..
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Thermo-Bond 180 is designed for the fastest and most continuous high heat transfer. Thermo-Bond 180 measures several times faster heat dissipa..
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Thermo-Bond 56 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, in..
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Thermo-Bond 90 is designed for the fastest and most continuous high heat transfer. Thermo-Bond 90 measures several times faster heat dissipation th..
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Thermo-Bond 110 is flame retardant and is designed to meet the rigid requirement of UL-94-V0. Thermo-Bond 110 is heavily filled alumina oxide ep..
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Please see alternative product as this product has high MOQsThermo-Bond 53 is a thixotropic (smooth paste) thermal conductive epoxy system It is..
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Thermo-Bond 24 is flame retardant and is designed to meet the rigid requirement of UL-94-V0. Thermo-Bond 24 is heavily filled alumina oxide epoxy form..
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Thermo-Bond 51 is a thixotropic (smooth paste) heat conductive epoxy system that passes the NASA Outgassing Specification (TML :0.65 CVCM:..
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