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Electro-Bond 24 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electr..
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Highly Conductive Pure Silver Epoxy Elecrically Conductive Adhesive Easy 1 to 1 Mix Ratio Dispensing
Electro-Bond 07 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of ..
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AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packag..
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Electro-Bond 01 is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically co..
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Thermo-Bond 54 is recommended for high temperature aerospace and electronic applications where the combination of good thermal conductivity AND low el..
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Thermo-Bond 180 is designed for the fastest and most continuous high heat transfer. Thermo-Bond 180 measures several times faster heat dissipa..
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Thermo-Bond 56 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, in..
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Thermo-Bond 90 is designed for the fastest and most continuous high heat transfer. Thermo-Bond 90 measures several times faster heat dissipation th..
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Thermo-Bond 110 is flame retardant and is designed to meet the rigid requirement of UL-94-V0. Thermo-Bond 110 is heavily filled alumina oxide ep..
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Please see alternative product as this product has high MOQsThermo-Bond 53 is a thixotropic (smooth paste) thermal conductive epoxy system It is..
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Thermo-Bond 95 is a two components, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits and ..
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Thermo-Bond 24 is flame retardant and is designed to meet the rigid requirement of UL-94-V0. Thermo-Bond 24 is heavily filled alumina oxide epoxy form..
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$9.99
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