Thermally Conductive Electrically Insulating Low Thermal Expansion Adhesive Epoxy Adhesive

Thermo-Bond 110 is flame retardant and is designed to meet the rigid requirement of UL-94-V0.  Thermo-Bond 110 is heavily filled alumina oxide epoxy formulations characterized by outstanding physical, electrical, insulation, and thermal dissipation properties which exhibit exceptional thermal conductivity, low thermal expansion, as well as excellent chemical and solvent resistance.

Typical Properties
Components	2
Mix Ratio	100/5
Working Life @ 25°C	2 hours
Particle Size	44
Shelf Life	1 year
Cure Type	Room Temp
Typical Applications
is designed to meet those applications which require electrical, physical and thermal properties with a service temperature Up to 205C
Physical Properties
Appearance	Black
Filler	Alumina
Viscosity	3000
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI	17000
Specific Gravity @ 25°C	2.3
Hardness	92
Lap Shear Strength	8500
Reactive Solids Content, %	100
Shrinkage Linear, IN/IN	0.001
Tensile Strength, PSI	8500
Electrical Properties
Volume Resistivity	4.90E+16 ohm. cm
Dielectric Constant	6.4
Dielectric Strength	560
Dissipation Factor KV/IN	0.018
Thermal Properties
Operating Temp	from –50 to +205°C
Glass Transition Temp (Tg)
Thermal Expansion Coefficient, per °C	30
Heat Distortion, °C	175
Thermal Conductivity W/M-K	1.66
Thermal Conductivity BTU-IN/HR-FT²-°F	11.5