Thermally Conductive Epoxy High Heat Transfer Adhesive Electrically Insulating Boron Nitride Filled

Thermo-Bond 95 is a two components, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards. This adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. Thermo-Bond 95 bonds readily to itself and to metals, silica, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured Thermo-Bond 95 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.

Typical Properties
Components	2
Mix Ratio	100/15
Working Life @ 25°C	60 Minutes
Particle Size	45
Shelf Life	1 year
Cure Type	Room Temp / Heat Cure
Typical Applications
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards
Physical Properties
Appearance	Off White
Filler	Boron Nitride
Viscosity	Paste
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Outgassing, NASA %CVCM	0.02
Outgassing, NASA %TML	0.6
Compressive Strength, PSI	6500
Specific Gravity @ 25°C	1.30
Hardness	80
Lap Shear Strength	1250
Reactive Solids Content, %	100
Shrinkage Linear, IN/IN	0.003
Tensile Strength, PSI	3400
Electrical Properties
Volume Resistivity	3.4 E+15 ohm. cm
Thermal Properties
Operating Temp	from –50 to +170°C
Glass Transition Temp (Tg)	54
Thermal Expansion Coefficient, per °C
Heat Distortion, °C	175
Thermal Conductivity W/M-K	0.46
Thermal Conductivity BTU-IN/HR-FT²-°F	3.2