Thermally Conductive High Temperature Epoxy Adhesive Max 425F Heat Cure Low Viscosity

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Brand: ConductiveX
Product Code: Thermo-Bond 180

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Thermally Conductive High Temperature Epoxy Adhesive Max 425F Heat Cure Low Viscosity

Description

Thermo-Bond 180 is designed for the fastest and most continuous high heat transfer. Thermo-Bond 180 measures several times faster heat dissipation than other commercial types. This system can be easily mixed and poured to form a dimensionally stable heat transfer package.

Typical Properties
Components	2
Mix Ratio	100/10
Working Life @ 25°C	90 Minutes
Particle Size	44
Shelf Life	1 year
Cure Type	Heat Cure
Typical Applications
Very long pot life heat curing for large casting and those applications requiring optimum properties with operating temperature up 425F

Physical Properties
Appearance	Black
Filler	Alumina
Viscosity	55000
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI	15000
Specific Gravity @ 25°C	1.9
Hardness	90
Lap Shear Strength	8800
Reactive Solids Content, %	100
Shrinkage Linear, IN/IN	0.003
Tensile Strength, PSI	8800

Electrical Properties
Volume Resistivity	1.5 E15 ohm. cm
Dielectric Constant	4.4
Dielectric Strength	485
Dissipation Factor KV/IN	0.015

Thermal Properties
Operating Temp	from –50 to +150°C
Glass Transition Temp (Tg)
Thermal Expansion Coefficient, per °C	14
Heat Distortion, °C	175
Thermal Conductivity W/M-K	1.44
Thermal Conductivity BTU-IN/HR-FT²-°F	10

TDS / SDS

TDS | SDS

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