Thermally Conductive Electrically Insulating Low Thermal Expansion Adhesive Epoxy Adhesive
Click Image for Gallery
Thermo-Bond 110 is flame retardant and is designed to meet the rigid requirement of UL-94-V0. Thermo-Bond 110 is heavily filled alumina oxide epoxy formulations characterized by outstanding physical, electrical, insulation, and thermal dissipation properties which exhibit exceptional thermal conductivity, low thermal expansion, as well as excellent chemical and solvent resistance.
Typical Properties |
|
| Components | 2 |
| Mix Ratio | 100/5 |
| Working Life @ 25°C | 2 hours |
| Hardness, Shore D | 92 |
| Particle Size | 44 |
| Shelf Life | 1 year |
| Cure Type | Room Temp |
| Cure Schedule | 24 hrs@ room temperature 10 min@ 175 °F 3 min@ 225°F |
| Benefits | |
| Formulated to meet those applications which require electrical, physical and thermal properties with a service temperature Up to 205C | |
| Typical Applications | |
| is designed to meet those applications which require electrical, physical and thermal properties with a service temperature Up to 205C | |
Physical Properties |
|
| Appearance | Black |
| Filler | Alumina |
| Viscosity | 3000 |
| Substrates | aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board |
| Density @ 25°C | |
| Compressive Strength, PSI | 17000 |
| Specific Gravity @ 25°C | 2.3 |
| Hardness | 92 |
| Lap Shear Strength | 8500 |
| Reactive Solids Content, % | 100 |
| Shrinkage Linear, IN/IN | 0.001 |
| Tensile Strength, PSI | 8500 |
Electrical Properties |
|
| Volume Resistivity | 4.90E+16 ohm. cm |
| Dielectric Constant | 6.4 |
| Dielectric Strength | 560 |
| Dissipation Factor KV/IN | 0.018 |
Thermal Properties |
|
| Thermal Conductivity @ 25 °C | |
| Operating Temp | from –50 to +205°C |
| Glass Transition Temp (Tg) | |
| Thermal Expansion Coefficient, per °C | 30 |
| Heat Distortion, °C | 175 |
| Thermal Conductivity W/M-K | 1.66 |
| Thermal Conductivity BTU-IN/HR-FT²-°F | 11.5 |
