Silver Filled Epoxy Adhesive, Electrically Conductive Adhesive, Circuit Repair, 1 Part Heat Cure

Electro-Bond 01 is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates. Electro-Bond 01 shows slight settling when stored for a long period of time, no caking and will re disperse to a smooth homogeneous state. Electro-Bond 01 formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others. Electro-Bond 01 designed for use in diversified applications as microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, static shielding, connections, and circuitry."

Typical Properties
Components	1
Working Life @ 25°C	6 months
Particle Size	40
Shelf Life	6 months
Cure Type	Heat Cure
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry
Physical Properties
Appearance	Silver
Filler	Silver
Viscosity	Paste
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI	12000
Specific Gravity @ 25°C	2.79
Hardness	83
Lap Shear Strength	8700
Tensile Strength, PSI	8700
Electrical Properties
Volume Resistivity	1.70 E-04 ohm. cm
Thermal Properties
Operating Temp	from –50 to +170°C
Glass Transition Temp (Tg)
Thermal Expansion Coefficient, per °C	0.49
Heat Distortion, °C	175
Thermal Conductivity W/M-K	2.65
Thermal Conductivity BTU-IN/HR-FT²-°F	18.37