Flexible Thermally Conductive Adhesive Electrically Insulating Epoxy Low Thermal Expansion Cooling

Thermo-bond 58 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. Thermo-Bond 58 bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured Thermo-Bond 58 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.

Typical Properties
Components	2
Mix Ratio	100/38
Working Life @ 25°C	2 hours
Particle Size	44
Shelf Life	1 year
Cure Type	Room Temp / Heat Cure
Typical Applications
Staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards
Physical Properties
Appearance	Grey
Filler	Alumina
Viscosity	Paste
Substrates	metals, silica, steatite, alumina, and other ceramics, glass, plastics and to many other materials
Density @ 25°C
Compressive Strength, PSI	8500
Specific Gravity @ 25°C	2.3
Hardness	60
Lap Shear Strength	1850
Reactive Solids Content, %	100
Tensile Strength, PSI	3500
Electrical Properties
Volume Resistivity	2.0 E+15 ohm. cm
Dielectric Constant	6
Dielectric Strength	410
Thermal Properties
Operating Temp	from –50 to +125°C
Glass Transition Temp (Tg)
Thermal Expansion Coefficient, per °C
Heat Distortion, °C	125
Thermal Conductivity W/M-K	0.82