Electrically Conductive Nickel Epoxy, Medium Conductivity, High Viscosity Room Temp Cure

Electro-Bond 03 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an lectrical resistivity value of less than 3.8x10-2 ohm-cm. Electro-Bond 03 is recommended for electronic bonding and sealing applications that require both fine electrical and mechanical properties. Electro-Bond 03 has been used extensively in such diversified applications as icrowave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical."

Typical Properties
Components	2
Mix Ratio	100/5
Working Life @ 25°C	60 Minutes
Particle Size	40
Shelf Life	1 year
Cure Type	Room Temp / Heat Cure
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.
Physical Properties
Appearance	Grey
Filler	Nickel
Viscosity	Paste
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI	13500
Specific Gravity @ 25°C	2.69
Hardness	85
Lap Shear Strength	1100
Reactive Solids Content, %	100
Shrinkage Linear, IN/IN	0.003
Tensile Strength, PSI	8900
Electrical Properties
Volume Resistivity	<0.038 ohm. cm
Thermal Properties
Operating Temp	from –50 to +170°C
Glass Transition Temp (Tg)	60°C
Thermal Expansion Coefficient, per °C	0.45
Heat Distortion, °C	130
Thermal Conductivity W/M-K	1.44
Thermal Conductivity BTU-IN/HR-FT²-°F	10