Electrically Conductive Silver Filled Adhesive Thermally Conductive Silver Epoxy 1 Part Heat Cure

Electro-Bond 20 is one part Electrically Conductive Adhesives, used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditional methods such as solder, are not practical. Electrically Conductive Adhesives are ideal for attaching temperature sensitive components, or providing electrical interconnections on non-solderable substrates, such as plastic and glass.

Typical Properties
Components	1
Working Life @ 25°C	6 months
Particle Size	44
Shelf Life	6 months
Cure Type	Heat Cure
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.
Physical Properties
Appearance	Silver
Filler	Silver
Viscosity	Paste
Substrates	aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI	9,000
Specific Gravity @ 25°C	2.61
Hardness	80
Lap Shear Strength	900
Reactive Solids Content, %	100
Tensile Strength, PSI	3,500
Electrical Properties
Volume Resistivity	3.00 E-4 ohm. cm
Thermal Properties
Operating Temp	from –50 to +170°C
Glass Transition Temp (Tg)	42°C
Thermal Expansion Coefficient, per °C
Heat Distortion, °C	170
Thermal Conductivity W/M-K	1.43
Thermal Conductivity BTU-IN/HR-FT²-°F	10.2