High Heat Electrically Conductive Silver High Temp Resistant Thermally Conductive Adhesive

High Heat Electrically Conductive Silver High Temp Resistant Thermally Conductive Adhesive
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  • Brand: ConductiveX
  • Product Code: Electro-Bond 24
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High Heat Electrically Conductive Silver High Temp Resistant Thermally Conductive Adhesive
Electro-Bond 24 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperature range (Up to 190°C) are required. This smooth paste formulation of refined pure silver and epoxy is free of solvents and copper or carbon additives. It can be used -- after REQUIRED high temperature cure cycle -- for the assembly, manufacture and repair of electronic modules, printed circuits, integrated circuits, electrical contacts, capacitors, wave guides and flat cables, for high-frequency RF shieldings, and for applications where a "hot" soldering iron is impractical. Fully cured Electro-Bond 24 is a hard, dimensionally stable, conductive material which is resistant to water, weathering, gases and vapors, lubricants, fuels, alcohol, and also to those salts, salt solutions, mild acids and alkalis, and other organic and inorganic compounds with which silver itself is compatible.

Typical Properties

Components 2
Mix Ratio 100/5
Working Life @ 25°C 180 Minutes
Particle Size Less than 2 Microns
Shelf Life 1 year
Cure Type Room Temp / Heat Cure
Typical Applications
EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry.

Physical Properties

Appearance Silver
Filler Silver
Viscosity Paste
Substrates aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board
Density @ 25°C
Compressive Strength, PSI 3500
Specific Gravity @ 25°C 2.63
Hardness 84
Lap Shear Strength 1270
Reactive Solids Content, % 100
Shrinkage Linear, IN/IN 0.003
Tensile Strength, PSI 1270

Electrical Properties

Volume Resistivity 2.00 E-03 ohm. cm

Thermal Properties

Operating Temp from –50 to +190°C
Glass Transition Temp (Tg) 92
Thermal Expansion Coefficient, per °C
Heat Distortion, °C 190
Thermal Conductivity W/M-K 1.5
Thermal Conductivity BTU-IN/HR-FT²-°F 10.4
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